P

Inventor

WOODS CARL

US35 patents
⚠️ This page may combine multiple inventors who share the name “WOODS CARL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

32 patents
US6988327B2Jan 24, 2006

Methods and systems for processing a substrate using a dynamic liquid meniscus

LAM RES CORP164 citations99
US7198055B2Apr 3, 2007

Meniscus, vacuum, IPA vapor, drying manifold

LAM RES CORP41 citations96
US7069937B2Jul 4, 2006

Vertical proximity processor

LAM RES CORP49 citations96
US7234477B2Jun 26, 2007

Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP55 citations95
US7389783B2Jun 24, 2008

Proximity meniscus manifold

LAM RES CORP24 citations92
US7350316B2Apr 1, 2008

Meniscus proximity system for cleaning semiconductor substrate surfaces

LAM RES CORP11 citations92
US7240679B2Jul 10, 2007

System for substrate processing with meniscus, vacuum, IPA vapor, drying manifold

LAM RES CORP12 citations92
US7513262B2Apr 7, 2009

Substrate meniscus interface and methods for operation

LAM RES CORP12 citations84
US6729339B1May 4, 2004

Method and apparatus for cooling a resonator of a megasonic transducer

LAM RES CORP13 citations84
US7811424B1Oct 12, 2010

Reducing mechanical resonance and improved distribution of fluids in small volume processing of semiconductor materials

LAM RES CORP11 citations83
US7350315B2Apr 1, 2008

Edge wheel dry manifold

LAM RES CORP11 citations82
US7395611B2Jul 8, 2008

System processing a substrate using dynamic liquid meniscus

LAM RES CORP7 citations74
US7387689B2Jun 17, 2008

Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

LAM RES CORP6 citations74
US7127831B2Oct 31, 2006

Methods and systems for processing a substrate using a dynamic liquid meniscus

LAM RES CORP9 citations74
US6702202B1Mar 9, 2004

Method and apparatus for fluid delivery to a backside of a substrate

LAM RES CORP9 citations74
US7913703B1Mar 29, 2011

Method and apparatus for uniformly applying a multi-phase cleaning solution to a substrate

LAM RES CORP6 citations73
US7722724B2May 25, 2010

Methods for substrate processing in cluster tool configurations having meniscus application systems

LAM RES CORP2 citations63
US7464719B2Dec 16, 2008

Multi-menisci processing apparatus

LAM RES CORP3 citations63
US7383844B2Jun 10, 2008

Meniscus, vacuum, IPA vapor, drying manifold

LAM RES CORP2 citations63
US7128279B2Oct 31, 2006

Method and apparatus for fluid delivery to a backside of a substrate

LAM RES CORP3 citations63
US7862693B2Jan 4, 2011

Apparatus for plating semiconductor wafers

LAM RES CORP4 citations62
US7293571B2Nov 13, 2007

Substrate proximity processing housing and insert for generating a fluid meniscus

LAM RES CORP4 citations62
US7828951B2Nov 9, 2010

Wafer support apparatus for electroplating process and method for using the same

LAM RES CORP0 citations52
US7731802B2Jun 8, 2010

Methods for transitioning a fluid meniscus to and from surfaces of a substrate

LAM RES CORP0 citations52
US7566390B2Jul 28, 2009

Wafer support apparatus for electroplating process and method for using the same

LAM RES CORP0 citations52
US7406972B2Aug 5, 2008

Substrate proximity processing structures

LAM RES CORP1 citations52
US6857435B2Feb 22, 2005

Method and apparatus for cooling a resonator of a megasonic transducer

LAM RES CORP1 citations52
US8726919B2May 20, 2014

Method and system for uniformly applying a multi-phase cleaning solution to a substrate

LAM RES CORP0 citations51
US8048283B2Nov 1, 2011

Method and apparatus for plating semiconductor wafers

LAM RES CORP0 citations51
US7704367B2Apr 27, 2010

Method and apparatus for plating semiconductor wafers

LAM RES CORP0 citations51
US7645364B2Jan 12, 2010

Apparatus and method for plating semiconductor wafers

LAM RES CORP1 citations51
US7452408B2Nov 18, 2008

System and method for producing bubble free liquids for nanometer scale semiconductor processing

LAM RES CORP0 citations51

BOYD JOHN

1 patent

FARBER JEFFREY J

1 patent

RAVKIN MICHAEL

1 patent