Inventor

O MIN-HO

KR2 patents

Patents

2 patents

US7626254B2Dec 1, 2009

Semiconductor package using chip-embedded interposer substrate

SAMSUNG ELECTRONICS CO LTD9 citations82

US7888785B2Feb 15, 2011

Semiconductor package embedded in substrate, system including the same and associated methods

SAMSUNG ELECTRONICS CO LTD11 citations81