Inventor
LEE JAEGOO
KR33 patents
⚠️ This page may combine multiple inventors who share the name “LEE JAEGOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
17 patentsUS9472568B2Oct 18, 2016
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD152 citations98
US9130054B2Sep 8, 2015
Semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD29 citations93
US9437483B2Sep 6, 2016
Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices
SAMSUNG ELECTRONICS CO LTD16 citations92
US10229927B2Mar 12, 2019
Semiconductor device and method of manufacturing the semiconductor device
SAMSUNG ELECTRONICS CO LTD18 citations85
US9559112B2Jan 31, 2017
Semiconductor devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD8 citations84
US9385139B2Jul 5, 2016
Three dimensional semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD13 citations84
US10741577B2Aug 11, 2020
Three-dimensional semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD7 citations83
US12046565B2Jul 23, 2024
Vertical memory device with metal and spacer support structure
SAMSUNG ELECTRONICS CO LTD2 citations73
US9768193B2Sep 19, 2017
Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devices
SAMSUNG ELECTRONICS CO LTD3 citations73
US9305933B2Apr 5, 2016
Methods of forming semiconductor memory devices
SAMSUNG ELECTRONICS CO LTD5 citations73
US9093479B2Jul 28, 2015
Method of forming nonvolatile memory device
SAMSUNG ELECTRONICS CO LTD4 citations72
US9142563B2Sep 22, 2015
Three dimensional semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US11588035B2Feb 21, 2023
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD1 citations62
US11430807B2Aug 30, 2022
Three-dimensional memory device including word line including polysilicon and metal
SAMSUNG ELECTRONICS CO LTD0 citations52
US11417603B2Aug 16, 2022
Semiconductor devices
SAMSUNG ELECTRONICS CO LTD0 citations52
US10109747B2Oct 23, 2018
Semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US9012320B2Apr 21, 2015
Three-dimensional semiconductor memory devices and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
LEE JAEGOO
8 patentsUS8704288B2Apr 22, 2014
Methods for forming etch stop layers, semiconductor devices having the same, and methods for fabricating semiconductor devices
LEE JAEGOO40 citations94
US8741761B2Jun 3, 2014
Methods of manufacturing three-dimensional semiconductor devices
LEE JAEGOO28 citations91
US9911750B2Mar 6, 2018
Semiconductor memory devices including asymmetric word line pads
LEE JAEGOO8 citations84
US9362303B2Jun 7, 2016
Semiconductor memory devices including fine patterns and methods of fabricating the same
LEE JAEGOO19 citations84
US9362226B2Jun 7, 2016
Three-dimensional (3D) semiconductor devices and methods of fabricating 3D semiconductor devices
LEE JAEGOO7 citations84
US8822322B2Sep 2, 2014
Semiconductor devices and methods of fabricating the same
LEE JAEGOO15 citations84
US8742488B2Jun 3, 2014
Three-dimensional semiconductor memory devices and methods of fabricating the same
LEE JAEGOO5 citations82
US8872253B2Oct 28, 2014
Semiconductor memory devices
LEE JAEGOO3 citations62
LG CHEMICAL LTD
5 patentsUS11685751B2Jun 27, 2023
Compound and organic light-emitting element comprising same
LG CHEMICAL LTD3 citations70
US11926607B2Mar 12, 2024
Compound and organic light emitting device comprising the same
LG CHEMICAL LTD0 citations60
US12391678B2Aug 19, 2025
Compound and organic light emitting device comprising same
LG CHEMICAL LTD0 citations52
US12120948B2Oct 15, 2024
Boron-containing compound and organic light-emitting element comprising same
LG CHEMICAL LTD0 citations51
US11950440B2Apr 2, 2024
Organic light emitting device
LG CHEMICAL LTD0 citations44