P

Inventor

CHIU SHIH-CHUAN

TW27 patents
⚠️ This page may combine multiple inventors who share the name “CHIU SHIH-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US11222892B2Jan 11, 2022

Backside power rail and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US11955515B2Apr 9, 2024

Dual side contact structures in semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11804486B2Oct 31, 2023

Backside power rail and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11777003B2Oct 3, 2023

Semiconductor structure with wraparound backside amorphous layer

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11502201B2Nov 15, 2022

Semiconductor device with backside power rail and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11482595B1Oct 25, 2022

Dual side contact structures in semiconductor devices

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11335592B2May 17, 2022

Contact resistance between via and conductive line

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11018012B2May 25, 2021

Contact structures with deposited silicide layers

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US12457794B2Oct 28, 2025

Dual side contact structures for source/drain regions in semiconductor transistor devices and method of forming

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12432994B2Sep 30, 2025

Source/drain metal contact and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12382709B2Aug 5, 2025

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12363939B2Jul 15, 2025

Semiconductor device with backside power rail and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266700B2Apr 1, 2025

Semiconductor nanostructures device structure with backside contact

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266566B2Apr 1, 2025

Contact resistance between via and conductive line

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148805B2Nov 19, 2024

Semiconductor structure with wraparound backside amorphous layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125852B2Oct 22, 2024

Multi-gate transistors with backside power rail and reduced gate-drain capacitance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12027372B2Jul 2, 2024

Contact structures with deposited silicide layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12009254B2Jun 11, 2024

Contact resistance between via and conductive line

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11978773B2May 7, 2024

Formation method of semiconductor device structure with semiconductor nanostructures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11955552B2Apr 9, 2024

Semiconductor device with backside power rail and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901238B2Feb 13, 2024

Semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855144B2Dec 26, 2023

Source/drain metal contact and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11557484B2Jan 17, 2023

Contact structures with deposited silicide layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342229B2May 24, 2022

Method for forming a semiconductor device structure having an electrical connection structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11043558B2Jun 22, 2021

Source/drain metal contact and formation thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12588242B2Mar 24, 2026

Field effect transistor with dual silicide and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59

ASUSTEK COMP INC

1 patent