Inventor
BOHRA MAHESH
US11 patents
⚠️ This page may combine multiple inventors who share the name “BOHRA MAHESH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
6 patentsUS8358509B2Jan 22, 2013
Reduced wiring requirements with signal slope manipulation
IBM2 citations60
US9773725B2Sep 26, 2017
Coreless multi-layer circuit substrate with minimized pad capacitance
IBM0 citations49
US9548769B2Jan 17, 2017
Reduced wiring requirements with signal slope manipulation
IBM0 citations49
US9980382B2May 22, 2018
Method of making a printed circuit board copper plane repair
IBM0 citations47
US9485866B2Nov 1, 2016
Printed circuit board copper plane repair
IBM0 citations47
US9374910B2Jun 21, 2016
Printed circuit board copper plane repair
IBM0 citations47
BILLS KEVIN
3 patentsUS8389870B2Mar 5, 2013
Coreless multi-layer circuit substrate with minimized pad capacitance
BILLS KEVIN6 citations79
US8975525B2Mar 10, 2015
Corles multi-layer circuit substrate with minimized pad capacitance
BILLS KEVIN0 citations47
US9060428B2Jun 16, 2015
Coreless multi-layer circuit substrate with minimized pad capacitance
BILLS KEVIN0 citations43