P

Inventor

CHUANG NAN-CHIN

TW18 patents
⚠️ This page may combine multiple inventors who share the name “CHUANG NAN-CHIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

14 patents
US10186492B1Jan 22, 2019

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US11335655B2May 17, 2022

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10483617B2Nov 19, 2019

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10312112B2Jun 4, 2019

Integrated fan-out package having multi-band antenna and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11004810B2May 11, 2021

Semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510693B2Dec 17, 2019

Semiconductor package structure

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10475757B2Nov 12, 2019

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12009575B2Jun 11, 2024

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11658392B2May 23, 2023

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11145595B2Oct 12, 2021

Integrated fan-out package with antenna components and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11043731B2Jun 22, 2021

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867940B2Dec 15, 2020

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10622222B2Apr 14, 2020

Integrated fan-out package having multi-band antenna and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10553533B2Feb 4, 2020

Integrated fan-out package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

REALTEK SEMICONDUCTOR CORP

4 patents