Inventor
CHO SUNG DONG
KR14 patents
⚠️ This page may combine multiple inventors who share the name “CHO SUNG DONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
10 patentsUS11289402B2Mar 29, 2022
Semiconductor device including TSV and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations83
US7879720B2Feb 1, 2011
Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation
SAMSUNG ELECTRONICS CO LTD7 citations83
US8841754B2Sep 23, 2014
Semiconductor devices with stress relief layers
SAMSUNG ELECTRONICS CO LTD8 citations80
US9559002B2Jan 31, 2017
Methods of fabricating semiconductor devices with blocking layer patterns
SAMSUNG ELECTRONICS CO LTD4 citations71
US9293415B2Mar 22, 2016
Semiconductor devices including protection patterns and methods of forming the same
SAMSUNG ELECTRONICS CO LTD4 citations71
US8890282B2Nov 18, 2014
Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrate
SAMSUNG ELECTRONICS CO LTD6 citations71
US11705386B2Jul 18, 2023
Semiconductor device including TSV and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11887840B2Jan 30, 2024
Semiconductor device and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations57
US6719917B2Apr 13, 2004
Method of ashing semiconductor device having metal interconnection
SAMSUNG ELECTRONICS CO LTD0 citations51
US9418915B2Aug 16, 2016
Semiconductor device and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations50