Inventor
YU KE-JING
TW14 patents
Patents
14 patentsUS10825721B2Nov 3, 2020
Insulating cap on contact structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US12040225B2Jul 16, 2024
Insulating cap on contact structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11139203B2Oct 5, 2021
Using mask layers to facilitate the formation of self-aligned contacts and vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11355603B2Jun 7, 2022
Methods and structures of novel contact feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12588237B2Mar 24, 2026
Method for forming via structure with low resistivity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11837663B2Dec 5, 2023
Via structure with low resistivity and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11393717B2Jul 19, 2022
Insulating cap on contact structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11081585B2Aug 3, 2021
Via structure with low resistivity and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11018057B2May 25, 2021
Semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10658237B2May 19, 2020
Semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US10522633B2Dec 31, 2019
Methods and structures of novel contact feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9728505B2Aug 8, 2017
Methods and structrues of novel contact feature
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12581711B2Mar 17, 2026
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10693004B2Jun 23, 2020
Via structure with low resistivity and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51