Inventor
ARVIN CHARLES LEON
US11 patents
Patents
11 patentsUS11282773B2Mar 22, 2022
Enlarged conductive pad structures for enhanced chip bond assembly yield
IBM2 citations72
US11152282B1Oct 19, 2021
Localized catalyst for enhanced thermal interface material heat transfer
IBM2 citations69
US11239183B2Feb 1, 2022
Mitigating thermal-mechanical strain and warpage of an organic laminate substrate
IBM0 citations61
US11756930B2Sep 12, 2023
High bandwidth module
IBM0 citations60
US11201136B2Dec 14, 2021
High bandwidth module
IBM0 citations60
US10993324B2Apr 27, 2021
Computer system with modified module socket
IBM0 citations58
US11694992B2Jul 4, 2023
Near tier decoupling capacitors
IBM0 citations57
US11121101B2Sep 14, 2021
Flip chip packaging rework
IBM0 citations50
US11031343B2Jun 8, 2021
Fins for enhanced die communication
IBM0 citations48
US12183702B2Dec 31, 2024
Electronic package with varying interconnects
IBM0 citations47
US11180398B2Nov 23, 2021
Deionized-water cooling for electrical equipment
IBM0 citations47