Inventor

SINGH BHUPENDER

US19 patents

⚠️ This page may combine multiple inventors who share the name “SINGH BHUPENDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SINGH BHUPENDER

IBM

Enlarged conductive pad structures for enhanced chip bond assembly yield

Polygon integrated circuit (IC) packaging

Electronic apparatus having inter-chip stiffener

High bandwidth module

High bandwidth module

Spacer for die-to-die communication in an integrated circuit and method for fabricating the same

Spacer for die-to-die communication in an integrated circuit

Near tier decoupling capacitors

Stacked capacitors for use in integrated circuit modules and the like

Direct attachment of capacitors to flip chip dies

Alignment carrier for interconnect bridge assembly

Fins for enhanced die communication

ST MICROELECTRONICS INT NV

Robust adaptive method and circuit for controlling a timing window for enabling operation of sense amplifier

Built-in self test circuit for segmented static random access memory (SRAM) array input/output

At-speed transition fault testing for a multi-port and multi-clock memory

Tuning of read/write cycle time delay for a memory circuit dependent on operational mode selection

Built-in self test circuit for segmented static random access memory (SRAM) array input/output

STRAND LIFE SCIENCES PRIVATE LTD

Apparatuses and methods for determining a patient&#39;s response to multiple cancer drugs

SFR LTD

Process for preparation of halo substituted benzoic acid compound and intermediates thereof

Apparatuses and methods for determining a patient's response to multiple cancer drugs