Inventor
LIANG SHUEN-SHIN
TW57 patents
Patents
50 patentsUS11393924B2Jul 19, 2022
Structure and formation method of semiconductor device with high contact area
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations86
US11626494B2Apr 11, 2023
Epitaxial backside contact
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US11158539B2Oct 26, 2021
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11855215B2Dec 26, 2023
Semiconductor device structure with high contact area
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11563083B2Jan 24, 2023
Dual side contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11227794B2Jan 18, 2022
Method for making self-aligned barrier for metal vias In-Situ during a metal halide pre-clean and associated interconnect structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11011413B2May 18, 2021
Interconnect structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US11688766B2Jun 27, 2023
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US11296187B2Apr 5, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12272752B2Apr 8, 2025
Gate all around (GAA) transistor structures having a plurality of semiconductor nanostructures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12593469B2Mar 31, 2026
Dual side source/drain contact structures in semiconductor devices and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12588268B2Mar 24, 2026
Liner-free conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12412779B2Sep 9, 2025
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400962B2Aug 26, 2025
Liner-free conductive structures with anchor points
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12369388B2Jul 22, 2025
Semiconductor devices with tunable low-K inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362234B2Jul 15, 2025
Contact structure for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349408B2Jul 1, 2025
Transistor gate contacts and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12341013B2Jun 24, 2025
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12324200B2Jun 3, 2025
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261082B2Mar 25, 2025
Semiconductor devices with a nitrided capping layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148807B2Nov 19, 2024
Backside contact structures with stacked metal silicide layers for source/drain region of fin field transistors
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12112974B2Oct 8, 2024
Integrated circuit isolation feature and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094952B2Sep 17, 2024
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12080766B2Sep 3, 2024
Epitaxial backside contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12057397B2Aug 6, 2024
Capping layer for liner-free conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051592B2Jul 30, 2024
Method and structure for barrier-less plug
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046634B2Jul 23, 2024
Dual side contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040372B2Jul 16, 2024
Contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11972974B2Apr 30, 2024
Self-aligned barrier for metal vias
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11929327B2Mar 12, 2024
Liner-free conductive structures with anchor points
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11901220B2Feb 13, 2024
Bilayer seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848238B2Dec 19, 2023
Methods for manufacturing semiconductor devices with tunable low-k inner air spacers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837544B2Dec 5, 2023
Liner-free conductive structures with anchor points
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11626482B2Apr 11, 2023
Air spacer formation with a spin-on dielectric material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11594609B2Feb 28, 2023
Liner-free conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11521929B2Dec 6, 2022
Capping layer for liner-free conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11502166B2Nov 15, 2022
Seal material for air gaps in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11489057B2Nov 1, 2022
Contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11387138B2Jul 12, 2022
Integrated circuit isolation feature and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12431431B2Sep 30, 2025
Conductive structure interconnects with downward projections
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12408394B2Sep 2, 2025
Semiconductor device structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12068252B2Aug 20, 2024
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12002867B2Jun 4, 2024
Contact structure for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11581259B2Feb 14, 2023
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12433006B2Sep 30, 2025
Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11894437B2Feb 6, 2024
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11817384B2Nov 14, 2023
Interconnect structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11217524B1Jan 4, 2022
Interconnect structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12432977B2Sep 30, 2025
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12363992B2Jul 15, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
Showing the top 50 of 57 patents by PatentIndex Score.