P

Inventor

CHI CHIH-CHIEN

TW57 patents
⚠️ This page may combine multiple inventors who share the name “CHI CHIH-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

48 patents
US9754822B1Sep 5, 2017

Interconnect structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD30 citations94
US11682624B2Jun 20, 2023

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11374127B2Jun 28, 2022

Multi-layer film device and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10727350B2Jul 28, 2020

Multi-layer film device and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10269627B2Apr 23, 2019

Interconnect structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10199500B2Feb 5, 2019

Multi-layer film device and method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9754882B2Sep 5, 2017

Interconnect structure having air gap and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9576892B2Feb 21, 2017

Semiconductor devices and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9496169B2Nov 15, 2016

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10790142B2Sep 29, 2020

Selective capping processes and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10770288B2Sep 8, 2020

Selective capping processes and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US10840134B2Nov 17, 2020

Interconnect structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10103099B2Oct 16, 2018

Semiconductor devices and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9917058B2Mar 13, 2018

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9887073B2Feb 6, 2018

Physical vapor deposition system and physical vapor depositing method using the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9640428B2May 2, 2017

Self-aligned repairing process for barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9567668B2Feb 14, 2017

Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9514928B2Dec 6, 2016

Selective repairing process for barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11380542B2Jul 5, 2022

Selective capping processes and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11742290B2Aug 29, 2023

Interconnect structure and method of forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10727118B2Jul 28, 2020

Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US9184134B2Nov 10, 2015

Method of manufacturing a semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations63
US12315764B2May 27, 2025

Conductive structures with barriers and liners of varying thicknesses

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255144B2Mar 18, 2025

Graphene liners and caps for semiconductor structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166128B2Dec 10, 2024

Multi-layer film device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159838B2Dec 3, 2024

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851749B2Dec 26, 2023

Semiconductor device, method and machine of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830742B2Nov 28, 2023

Selective capping processes and structures formed thereby

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11777035B2Oct 3, 2023

Multi-layer film device and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11345991B2May 31, 2022

Semiconductor device, method and machine of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11328952B2May 10, 2022

Interconnect structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152258B2Oct 19, 2021

Method of forming an interconnect in a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004793B2May 11, 2021

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394717B2Aug 19, 2025

Graphite-based interconnects and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12354958B2Jul 8, 2025

Semiconductor devices and methods of formation

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12322649B2Jun 3, 2025

Interconnect structure of semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12237261B2Feb 25, 2025

Semiconductor device having a contact structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12159830B2Dec 3, 2024

Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11996361B2May 28, 2024

Method of making a contact structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11652044B2May 16, 2023

Contact structure and method of making

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12334397B2Jun 17, 2025

Interconnect structure including graphite and method forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12165975B2Dec 10, 2024

Method of forming interconnect structure having a barrier layer

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11894437B2Feb 6, 2024

Hybrid conductive structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11791206B2Oct 17, 2023

Method for forming semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12543553B2Feb 3, 2026

Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10340223B2Jul 2, 2019

Method of forming an interconnect structure having an air gap and structure thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9873944B2Jan 23, 2018

Metal capping process and processing platform thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9805951B1Oct 31, 2017

Method of integration process for metal CMP

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

TAIWAN SEMICONDUCTOR MFG

2 patents

Showing the top 50 of 57 patents by PatentIndex Score.