Inventor
CHI CHIH-CHIEN
TW57 patents
⚠️ This page may combine multiple inventors who share the name “CHI CHIH-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
48 patentsUS9754822B1Sep 5, 2017
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD30 citations94
US11682624B2Jun 20, 2023
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations86
US11374127B2Jun 28, 2022
Multi-layer film device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10727350B2Jul 28, 2020
Multi-layer film device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10269627B2Apr 23, 2019
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10199500B2Feb 5, 2019
Multi-layer film device and method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9754882B2Sep 5, 2017
Interconnect structure having air gap and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9576892B2Feb 21, 2017
Semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9496169B2Nov 15, 2016
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10790142B2Sep 29, 2020
Selective capping processes and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations83
US10770288B2Sep 8, 2020
Selective capping processes and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US10840134B2Nov 17, 2020
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10103099B2Oct 16, 2018
Semiconductor devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9917058B2Mar 13, 2018
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9887073B2Feb 6, 2018
Physical vapor deposition system and physical vapor depositing method using the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9640428B2May 2, 2017
Self-aligned repairing process for barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9567668B2Feb 14, 2017
Plasma apparatus, magnetic-field controlling method, and semiconductor manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9514928B2Dec 6, 2016
Selective repairing process for barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11380542B2Jul 5, 2022
Selective capping processes and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US11742290B2Aug 29, 2023
Interconnect structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10727118B2Jul 28, 2020
Method for manufacturing semiconductor device and pre-clean apparatus for semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US9184134B2Nov 10, 2015
Method of manufacturing a semiconductor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations63
US12315764B2May 27, 2025
Conductive structures with barriers and liners of varying thicknesses
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12255144B2Mar 18, 2025
Graphene liners and caps for semiconductor structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166128B2Dec 10, 2024
Multi-layer film device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12159838B2Dec 3, 2024
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11851749B2Dec 26, 2023
Semiconductor device, method and machine of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830742B2Nov 28, 2023
Selective capping processes and structures formed thereby
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11777035B2Oct 3, 2023
Multi-layer film device and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11345991B2May 31, 2022
Semiconductor device, method and machine of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11328952B2May 10, 2022
Interconnect structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11152258B2Oct 19, 2021
Method of forming an interconnect in a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11004793B2May 11, 2021
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12394717B2Aug 19, 2025
Graphite-based interconnects and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12354958B2Jul 8, 2025
Semiconductor devices and methods of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12322649B2Jun 3, 2025
Interconnect structure of semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12237261B2Feb 25, 2025
Semiconductor device having a contact structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12159830B2Dec 3, 2024
Nitrogen plasma treatment for improving interface between etch stop layer and copper interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11996361B2May 28, 2024
Method of making a contact structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11652044B2May 16, 2023
Contact structure and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12334397B2Jun 17, 2025
Interconnect structure including graphite and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12165975B2Dec 10, 2024
Method of forming interconnect structure having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11894437B2Feb 6, 2024
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US11791206B2Oct 17, 2023
Method for forming semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12543553B2Feb 3, 2026
Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10340223B2Jul 2, 2019
Method of forming an interconnect structure having an air gap and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9873944B2Jan 23, 2018
Metal capping process and processing platform thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9805951B1Oct 31, 2017
Method of integration process for metal CMP
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
2 patentsShowing the top 50 of 57 patents by PatentIndex Score.