Inventor
Liu yi-ying
TW24 patents
Patents
24 patentsUS11462471B2Oct 4, 2022
Middle-of-line interconnect structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations74
US11973124B2Apr 30, 2024
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11563083B2Jan 24, 2023
Dual side contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11652149B2May 16, 2023
Common rail contact
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations72
US12593469B2Mar 31, 2026
Dual side source/drain contact structures in semiconductor devices and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12581689B2Mar 17, 2026
Multi-gate semiconductor device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400853B2Aug 26, 2025
Method of forming conductive feature including cleaning step
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12349408B2Jul 1, 2025
Transistor gate contacts and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334435B2Jun 17, 2025
Middle-of-line interconnect structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12170325B2Dec 17, 2024
Method of manufacturing a semiconductor device and a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12046634B2Jul 23, 2024
Dual side contact structures in semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12009294B2Jun 11, 2024
Middle-of-line interconnect structure and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955329B2Apr 9, 2024
Method of forming conductive feature including cleaning step
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670499B2Jun 6, 2023
Method of forming conductive feature including cleaning step
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300539B2May 13, 2025
Source/drain contact formation methods and devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12068252B2Aug 20, 2024
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11742240B2Aug 29, 2023
Source/drain contact formation methods and devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11581259B2Feb 14, 2023
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11257712B2Feb 22, 2022
Source/drain contact formation methods and devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11894437B2Feb 6, 2024
Hybrid conductive structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12506079B2Dec 23, 2025
Semiconductor device with backside power rail and methods of fabrication thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11424185B2Aug 23, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10269926B2Apr 23, 2019
Purging deposition tools to reduce oxygen and moisture in wafers
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12170331B2Dec 17, 2024
Conductive structures and methods of formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49