Inventor
ISHINO HIROSHI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “ISHINO HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
14 patentsUS9351423B2May 24, 2016
Semiconductor device and semiconductor device connection structure
DENSO CORP7 citations82
US11380656B2Jul 5, 2022
Semiconductor device
DENSO CORP4 citations71
US9520345B2Dec 13, 2016
Semiconductor module, semiconductor device having semiconductor module, and method of manufacturing semiconductor module
DENSO CORP3 citations71
US11996344B2May 28, 2024
Semiconductor device
DENSO CORP2 citations70
US11456238B2Sep 27, 2022
Semiconductor device including a semiconductor chip connected with a plurality of main terminals
DENSO CORP3 citations70
US11908778B2Feb 20, 2024
Semiconductor module
DENSO CORP2 citations68
US9729044B2Aug 8, 2017
Power conversion device having two serially-connected switching elements
DENSO CORP3 citations60
US12278170B2Apr 15, 2025
Semiconductor module, electrical component, and connection structure of the semiconductor module and the electrical component
DENSO CORP0 citations59
US11817429B2Nov 14, 2023
Plurality of chips between two heat sinks
DENSO CORP0 citations50
US9905541B2Feb 27, 2018
Semiconductor module with bus bar including stacked wiring layers
DENSO CORP1 citations50
US11488895B2Nov 1, 2022
Semiconductor device and maunfacturing method of semiconductor device
DENSO CORP0 citations48
US12438071B2Oct 7, 2025
Semiconductor module and method for manufacturing semiconductor module
DENSO CORP0 citations39
US10535577B2Jan 14, 2020
Semiconductor device
DENSO CORP0 citations39
US10008433B2Jun 26, 2018
Semiconductor device
DENSO CORP0 citations38