Inventor
CHEN YANG-CHE
TW28 patents
⚠️ This page may combine multiple inventors who share the name “CHEN YANG-CHE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
27 patentsUS11626343B2Apr 11, 2023
Semiconductor device with enhanced thermal dissipation and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US10510734B2Dec 17, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10276548B2Apr 30, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US11088037B2Aug 10, 2021
Semiconductor device having probe pads and seal ring
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11804433B2Oct 31, 2023
Semiconductor package structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11769698B2Sep 26, 2023
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10937858B2Mar 2, 2021
Method for manufacturing semiconductor and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10867976B2Dec 15, 2020
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10347548B2Jul 9, 2019
Integrated circuit package structure and testing method using the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12243788B2Mar 4, 2025
Method of testing semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12183655B2Dec 31, 2024
Semiconductor device with enhanced thermal dissipation and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12027433B2Jul 2, 2024
Semiconductor package and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11993512B2May 28, 2024
Dual micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776919B2Oct 3, 2023
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11721597B2Aug 8, 2023
Semiconductor device and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11482461B2Oct 25, 2022
Semiconductor package and method for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11450626B2Sep 20, 2022
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11274037B2Mar 15, 2022
Dual micro-electro mechanical system and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10937772B2Mar 2, 2021
Semiconductor package and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908884B2Feb 20, 2024
Inductive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11854913B2Dec 26, 2023
Method for detecting defects in semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11322576B2May 3, 2022
Inductive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12426283B2Sep 23, 2025
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US11837526B2Dec 5, 2023
Semiconductor package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10629673B2Apr 21, 2020
Method for manufacturing semiconductor and structure thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9254999B2Feb 9, 2016
Mechanisms for forming micro-electro mechanical device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US10699977B2Jun 30, 2020
Method of detecting delamination in an integrated circuit package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51