Inventor

TSENG HUANG-WEN

TW26 patents

⚠️ This page may combine multiple inventors who share the name “TSENG HUANG-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSENG HUANG-WEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device with enhanced thermal dissipation and method for making the same

Semiconductor device having probe pads and seal ring

Magnetic random access memory with various size magnetic tunneling junction film stacks

Semiconductor package structure and method for forming the same

Method for manufacturing semiconductor and structure thereof

Integrated circuit package structure and testing method using the same

Magnetic random access memory

Magnetic random access memory with various size magnetic tunneling junction film stacks

Semiconductor device with enhanced thermal dissipation and method for making the same

Semiconductor package and method for making the same

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor package

Semiconductor device and manufacturing method of the same

Semiconductor package and method for making the same

Semiconductor package

Structure and method for single gate non-volatile memory device

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor package and method for manufacturing the same

Inductive device

Method for detecting defects in semiconductor device

Inductive device

Semiconductor package structure and method for manufacturing the same

Method for manufacturing semiconductor and structure thereof

Structure and method for single gate non-volatile memory device

Method of detecting delamination in an integrated circuit package structure

TAIWAN SEMICONDUCTOR MFG COMPANY LTD

Dual micro-electro mechanical system and manufacturing method thereof