Inventor
SUZUKI TAKUYA
JP118 patents
⚠️ This page may combine multiple inventors who share the name “SUZUKI TAKUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
11 patentsUS6876846B2Apr 5, 2005
High frequency module
MITSUBISHI ELECTRIC CORP54 citations95
US7504710B2Mar 17, 2009
Multilayer dielectric substrate and semiconductor package
MITSUBISHI ELECTRIC CORP16 citations93
US7336221B2Feb 26, 2008
High frequency package, transmitting and receiving module and wireless equipment
MITSUBISHI ELECTRIC CORP37 citations92
US8040286B2Oct 18, 2011
High frequency module
MITSUBISHI ELECTRIC CORP25 citations90
US7994881B2Aug 9, 2011
Waveguide connection between a multilayer waveguide substrate and a metal waveguide substrate including a choke structure in the multilayer waveguide
MITSUBISHI ELECTRIC CORP7 citations84
US7847644B2Dec 7, 2010
Modulation signal generation circuit, transmission/reception module, and radar device
MITSUBISHI ELECTRIC CORP13 citations84
US8358185B2Jan 22, 2013
Waveguide connection between a dielectric substrate and a waveguide substrate having a choke structure in the dielectric substrate
MITSUBISHI ELECTRIC CORP12 citations81
US7498907B2Mar 3, 2009
Transmission line substrate and semiconductor package
MITSUBISHI ELECTRIC CORP11 citations80
US7164905B2Jan 16, 2007
High frequency module
MITSUBISHI ELECTRIC CORP8 citations73
US12306289B2May 20, 2025
Radar device, method of detecting failure of radar device, and method of operating radar device
MITSUBISHI ELECTRIC CORP0 citations63
US11921186B2Mar 5, 2024
Radar device, method of detecting failure of radar device, and method of operating radar device
MITSUBISHI ELECTRIC CORP0 citations63
FURUKAWA ELECTRIC CO LTD
6 patentsUS3983521ASep 28, 1976
Flexible superconducting composite compound wires
FURUKAWA ELECTRIC CO LTD55 citations95
US5495668AMar 5, 1996
Manufacturing method for a supermicro-connector
FURUKAWA ELECTRIC CO LTD57 citations92
US4078299AMar 14, 1978
Method of manufacturing flexible superconducting composite compound wires
FURUKAWA ELECTRIC CO LTD39 citations92
US5266416ANov 30, 1993
Aluminum-stabilized superconducting wire
FURUKAWA ELECTRIC CO LTD25 citations87
US4421946ADec 20, 1983
High current capacity superconductor
FURUKAWA ELECTRIC CO LTD14 citations72
US5228928AJul 20, 1993
Method of manufacturing Nb3 Sn superconducting wire
FURUKAWA ELECTRIC CO LTD10 citations70
SANYO ELECTRIC CO
5 patentsUS6599782B1Jul 29, 2003
Semiconductor device and method of fabricating thereof
SANYO ELECTRIC CO52 citations92
US6255154B1Jul 3, 2001
Semiconductor device and method of manufacturing the same
SANYO ELECTRIC CO43 citations92
US7056797B2Jun 6, 2006
Semiconductor device and method of manufacturing the same
SANYO ELECTRIC CO8 citations74
US6713331B2Mar 30, 2004
Semiconductor device manufacturing using one element separation film
SANYO ELECTRIC CO12 citations74
US6614075B2Sep 2, 2003
Semiconductor device and method of manufacturing the same
SANYO ELECTRIC CO6 citations73
JTEKT CORP
4 patentsSUZUKI TAKUYA
2 patentsMITSUBISHI CHEM CORP
2 patentsUS10414653B2Sep 17, 2019
Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet
MITSUBISHI CHEM CORP6 citations80
US10106413B2Oct 23, 2018
Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet
MITSUBISHI CHEM CORP2 citations69
NEC CORP
2 patentsMITSUBISHI GAS CHEMICAL CO
2 patentsUS11680139B2Jun 20, 2023
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO4 citations72
US11466123B2Oct 11, 2022
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
MITSUBISHI GAS CHEMICAL CO2 citations70
SUMITOMO WIRING SYSTEMS
2 patentsUS10601147B2Mar 24, 2020
Method of bonding core wire and bonding object, ultrasonic bonding device, and junction between core wire and bonding object
SUMITOMO WIRING SYSTEMS2 citations69
US10971878B2Apr 6, 2021
Method for manufacturing terminal-equipped electrical wire, terminal-equipped electrical wire, and ultrasonic welding device
SUMITOMO WIRING SYSTEMS2 citations65
FUJI ELECTRIC CO LTD
2 patentsNIPPON MUSICAL INSTRUMENTS MFG
1 patentSAIKI HIROSHI
1 patentSUZUKI HIROAKI
1 patentFUJITSU LTD
1 patentNUMAZAKI KAZUSHI
1 patentTAISEI KAKO CO
1 patentKUBO TOSHIKATSU
1 patentFUNAI ELECTRIC CO
1 patentNICHIA CORP
1 patentNETUREN CO LTD
1 patentOSAKA GAS CO LTD
1 patentSHIMA TOSHIHIKO
1 patentShowing the top 50 of 118 patents by PatentIndex Score.