Inventor
ROBBINS GORDON JAY
7 patents
Patents
7 patentsUS5796169AAug 18, 1998
Structurally reinforced ball grid array semiconductor package and systems
IBM112 citations94
US6395991B1May 28, 2002
Column grid array substrate attachment with heat sink stress relief
IBM54 citations90
US6053394AApr 25, 2000
Column grid array substrate attachment with heat sink stress relief
IBM39 citations90
US4006492AFeb 1, 1977
High density semiconductor chip organization
IBM23 citations80
US5817543AOct 6, 1998
Method of constructing an integrated circuit memory
IBM16 citations68
US5916451AJun 29, 1999
Minimal capture pads applied to ceramic vias in ceramic substrates
IBM4 citations61
US3986057AOct 12, 1976
High performance latch circuit
IBM4 citations61