Inventor

LAI CHIA-PING

TW85 patents

Patents

50 patents

US10546917B1Jan 28, 2020

Trench capacitor layout structure and method of forming same background

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94

US11862610B2Jan 2, 2024

Fan-out packages providing enhanced mechanical strength and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86

US11855130B2Dec 26, 2023

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86

US11728288B2Aug 15, 2023

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86

US12230613B2Feb 18, 2025

Vertical semiconductor package including horizontally stacked dies and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75

US12027475B2Jul 2, 2024

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75

US11940662B2Mar 26, 2024

Optical integrated circuit structure including edge coupling protective features and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US11892678B2Feb 6, 2024

Photonic device and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US11488993B2Nov 1, 2022

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71

US10777591B2Sep 15, 2020

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71

US11329125B2May 10, 2022

Integrated circuit including trench capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70

US12543593B2Feb 3, 2026

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12538850B2Jan 27, 2026

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12431467B2Sep 30, 2025

Fan-out packages providing enhanced mechanical strength and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12379557B2Aug 5, 2025

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12334487B2Jun 17, 2025

Method for forming a semiconductor die and a photoelectric device integrated in a same package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12230607B2Feb 18, 2025

Semiconductor device including power management die in a stack and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12224268B2Feb 11, 2025

Fan-out packages providing enhanced mechanical strength and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12218049B2Feb 4, 2025

Semiconductor structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12183695B2Dec 31, 2024

Method of manufacturing package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12107078B2Oct 1, 2024

Semiconductor die including fuse structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12068262B2Aug 20, 2024

Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US12021069B2Jun 25, 2024

Semiconductor die and photoelectric device integrated in same package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12015010B2Jun 18, 2024

Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US12009349B2Jun 11, 2024

Vertical semiconductor package including horizontally stacked dies and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US11854969B2Dec 26, 2023

Semiconductor structure and method for forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US11495536B2Nov 8, 2022

Semiconductor structure and method for forming thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63

US12417987B2Sep 16, 2025

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12322679B2Jun 3, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12278167B2Apr 15, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12272724B2Apr 8, 2025

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12125868B2Oct 22, 2024

Image sensors with dummy pixel structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12094925B1Sep 17, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11961866B2Apr 16, 2024

Method of making an image sensor with sidewall protection

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11908838B2Feb 20, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11776896B2Oct 3, 2023

Capacitor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US11545518B2Jan 3, 2023

Image sensor and method for fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12439713B2Oct 7, 2025

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US12364028B2Jul 15, 2025

Image sensor device and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

US12353034B2Jul 8, 2025

Optical integrated circuit structure including edge coupling protective features and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

Showing the top 50 of 85 patents by PatentIndex Score.

LAI CHIA-PING

Patents

Trench capacitor layout structure and method of forming same background

Fan-out packages providing enhanced mechanical strength and methods for forming the same

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

Semiconductor die including guard ring structure and three-dimensional device structure including the same

Vertical semiconductor package including horizontally stacked dies and methods of forming the same

Semiconductor die including guard ring structure and three-dimensional device structure including the same

Semiconductor structure and method for forming the same

Semiconductor die including fuse structure and methods for forming the same

Method of making a trench capacitor and trench capacitor

Package structure and method of manufacturing the same

Semiconductor structure and method for forming thereof

Image sensor device and methods of forming the same

Image sensor device and methods of forming the same

Image sensor device and methods of forming the same

Photonic device and fabrication method thereof

Photonic device and fabrication method thereof

Optical integrated circuit structure including edge coupling protective features and methods of forming same

Photonic device and method of making same

Image sensor device

Image sensor device

Integrated circuit including trench capacitor

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

Semiconductor package including semiconductor dies having different lattice directions and method of forming the same

Fan-out packages providing enhanced mechanical strength and methods for forming the same

Semiconductor structure and method for forming the same

Method for forming a semiconductor die and a photoelectric device integrated in a same package

Semiconductor device including power management die in a stack and methods of forming the same

Fan-out packages providing enhanced mechanical strength and methods for forming the same

Semiconductor structure and method for forming the same

Method of manufacturing package structure

Semiconductor die including fuse structure and methods for forming the same

Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the same

Semiconductor die and photoelectric device integrated in same package

Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the same

Vertical semiconductor package including horizontally stacked dies and methods of forming the same

Semiconductor structure and method for forming thereof

Semiconductor structure and method for forming thereof

Semiconductor die including guard ring structure and three-dimensional device structure including the same

Semiconductor die including through substrate via barrier structure and methods for forming the same

Semiconductor die including through substrate via barrier structure and methods for forming the same

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

Image sensors with dummy pixel structures

Three-dimensional device structure including embedded integrated passive device and methods of making the same

Method of making an image sensor with sidewall protection

Three-dimensional device structure including embedded integrated passive device and methods of making the same

Capacitor device and manufacturing method thereof

Image sensor and method for fabricating the same

Image sensor device

Image sensor device and methods of forming the same

Optical integrated circuit structure including edge coupling protective features and method of forming same