P

Inventor

LEE CHIEN-CHANG

TW40 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIEN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

29 patents
US11855130B2Dec 26, 2023

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11728288B2Aug 15, 2023

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US12027475B2Jul 2, 2024

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11327228B2May 10, 2022

Photonic device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11175452B1Nov 16, 2021

Photonic device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11892678B2Feb 6, 2024

Photonic device and method of making same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12417987B2Sep 16, 2025

Semiconductor die including guard ring structure and three-dimensional device structure including the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322679B2Jun 3, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278167B2Apr 15, 2025

Semiconductor die including through substrate via barrier structure and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12272724B2Apr 8, 2025

Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094925B1Sep 17, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908838B2Feb 20, 2024

Three-dimensional device structure including embedded integrated passive device and methods of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776896B2Oct 3, 2023

Capacitor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12169308B2Dec 17, 2024

Method of using fiber to chip coupler and method of making

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12153255B2Nov 26, 2024

Method of making photonic device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12072534B2Aug 27, 2024

Fiber to chip coupler and method of using

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12050348B2Jul 30, 2024

Fiber to chip coupler and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11892681B2Feb 6, 2024

Fiber to chip coupler and method of making the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11740409B2Aug 29, 2023

Photonic device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12519021B2Jan 6, 2026

Semiconductor package including test line structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12463099B2Nov 4, 2025

Semiconductor package including test line structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11973040B2Apr 30, 2024

Interposer with warpage-relief trenches

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12261133B2Mar 25, 2025

Interposer with warpage-relief trenches

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US12362323B2Jul 15, 2025

Three-dimensional integrated circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12094868B2Sep 17, 2024

Shielded deep trench capacitor structure and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12040242B2Jul 16, 2024

Three-dimensional device structure including seal ring connection circuit

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12009405B2Jun 11, 2024

Deep trench capacitor including a compact contact region and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11442230B2Sep 13, 2022

Silicon photonics coupling structure using an etch stop layer and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9995770B2Jun 12, 2018

Multidirectional semiconductor arrangement testing

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations47

LOGITECH EUROP SA

2 patents

LOGITECH EUROPE SA

2 patents

WINTEK CORP

2 patents

CATERPILLAR INC

2 patents

SHAO JHIH JIE

1 patent

TAIWAN SEMICONDUCTOR MFG

1 patent

TSENG HUAN-CHI

1 patent