Inventor
LEE CHIEN-CHANG
TW40 patents
⚠️ This page may combine multiple inventors who share the name “LEE CHIEN-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
29 patentsUS11855130B2Dec 26, 2023
Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations86
US11728288B2Aug 15, 2023
Semiconductor die including guard ring structure and three-dimensional device structure including the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations86
US12027475B2Jul 2, 2024
Semiconductor die including guard ring structure and three-dimensional device structure including the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations75
US11327228B2May 10, 2022
Photonic device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11175452B1Nov 16, 2021
Photonic device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11892678B2Feb 6, 2024
Photonic device and method of making same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12417987B2Sep 16, 2025
Semiconductor die including guard ring structure and three-dimensional device structure including the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12322679B2Jun 3, 2025
Semiconductor die including through substrate via barrier structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12278167B2Apr 15, 2025
Semiconductor die including through substrate via barrier structure and methods for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12272724B2Apr 8, 2025
Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12094925B1Sep 17, 2024
Three-dimensional device structure including embedded integrated passive device and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908838B2Feb 20, 2024
Three-dimensional device structure including embedded integrated passive device and methods of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11776896B2Oct 3, 2023
Capacitor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12169308B2Dec 17, 2024
Method of using fiber to chip coupler and method of making
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12153255B2Nov 26, 2024
Method of making photonic device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12072534B2Aug 27, 2024
Fiber to chip coupler and method of using
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12050348B2Jul 30, 2024
Fiber to chip coupler and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11892681B2Feb 6, 2024
Fiber to chip coupler and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11740409B2Aug 29, 2023
Photonic device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12519021B2Jan 6, 2026
Semiconductor package including test line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12463099B2Nov 4, 2025
Semiconductor package including test line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11973040B2Apr 30, 2024
Interposer with warpage-relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12261133B2Mar 25, 2025
Interposer with warpage-relief trenches
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations56
US12362323B2Jul 15, 2025
Three-dimensional integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12094868B2Sep 17, 2024
Shielded deep trench capacitor structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12040242B2Jul 16, 2024
Three-dimensional device structure including seal ring connection circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12009405B2Jun 11, 2024
Deep trench capacitor including a compact contact region and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11442230B2Sep 13, 2022
Silicon photonics coupling structure using an etch stop layer and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9995770B2Jun 12, 2018
Multidirectional semiconductor arrangement testing
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations47