P

Inventor

CHEN SZU-YING

TW132 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SZU-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

21 patents
US9960142B2May 1, 2018

Hybrid bonding with air-gap structure

TAIWAN SEMICONDUCTOR MFG CO LTD222 citations99
US9960129B2May 1, 2018

Hybrid bonding mechanisms for semiconductor wafers

TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10388642B2Aug 20, 2019

Hybrid bonding with uniform pattern density

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10157889B2Dec 18, 2018

Stacked semiconductor structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9536777B2Jan 3, 2017

Interconnect apparatus and method

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9530811B2Dec 27, 2016

Elevated photodiode with a stacked scheme

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9455158B2Sep 27, 2016

3DIC interconnect devices and methods of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9443836B2Sep 13, 2016

Forming pixel units of image sensors through bonding two chips

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11996399B2May 28, 2024

Hybrid bonding with uniform pattern density

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11978758B2May 7, 2024

Methods and apparatus for via last through-vias

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11600653B2Mar 7, 2023

Methods and apparatus for via last through-vias

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10510912B2Dec 17, 2019

Image sensor device and method

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10475843B2Nov 12, 2019

Method and apparatus for image sensor packaging

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10304818B2May 28, 2019

Method of manufacturing semiconductor devices having conductive plugs with varying widths

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10269863B2Apr 23, 2019

Methods and apparatus for via last through-vias

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10170512B2Jan 1, 2019

Uniform-size bonding patterns

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10096645B2Oct 9, 2018

Method and apparatus for image sensor packaging

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10062721B2Aug 28, 2018

Elevated photodiode with a stacked scheme

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9941249B2Apr 10, 2018

Multi-wafer stacking by Ox-Ox bonding

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9917123B2Mar 13, 2018

Method and apparatus for image sensor packaging

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9847364B2Dec 19, 2017

Image sensor devices and design and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73

TAIWAN SEMICONDUCTOR MFG

15 patents
US9337235B2May 10, 2016

Method and apparatus for image sensor packaging

TAIWAN SEMICONDUCTOR MFG227 citations99
US9312229B2Apr 12, 2016

Hybrid bonding with air-gap structure

TAIWAN SEMICONDUCTOR MFG228 citations99
US9299736B2Mar 29, 2016

Hybrid bonding with uniform pattern density

TAIWAN SEMICONDUCTOR MFG235 citations99
US9230941B2Jan 5, 2016

Bonding structure for stacked semiconductor devices

TAIWAN SEMICONDUCTOR MFG240 citations99
US9142517B2Sep 22, 2015

Hybrid bonding mechanisms for semiconductor wafers

TAIWAN SEMICONDUCTOR MFG247 citations98
US9123615B2Sep 1, 2015

Vertically integrated image sensor chips and methods for forming the same

TAIWAN SEMICONDUCTOR MFG11 citations93
US9257414B2Feb 9, 2016

Stacked semiconductor structure and method

TAIWAN SEMICONDUCTOR MFG14 citations92
US9190345B1Nov 17, 2015

Semiconductor devices and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG24 citations92
US8878325B2Nov 4, 2014

Elevated photodiode with a stacked scheme

TAIWAN SEMICONDUCTOR MFG12 citations92
US9293502B2Mar 22, 2016

Semiconductor switching device separated by device isolation

TAIWAN SEMICONDUCTOR MFG4 citations84
US9136302B2Sep 15, 2015

Apparatus for vertically integrated backside illuminated image sensors

TAIWAN SEMICONDUCTOR MFG11 citations84
US9123617B2Sep 1, 2015

Elevated photodiode with a stacked scheme

TAIWAN SEMICONDUCTOR MFG4 citations84
US8946784B2Feb 3, 2015

Method and apparatus for image sensor packaging

TAIWAN SEMICONDUCTOR MFG8 citations84
US9287310B2Mar 15, 2016

Methods and apparatus for glass removal in CMOS image sensors

TAIWAN SEMICONDUCTOR MFG3 citations73
US8933527B2Jan 13, 2015

Elevated photodiodes with crosstalk isolation

TAIWAN SEMICONDUCTOR MFG5 citations72

CHEN SZU-YING

7 patents

ENCODED THERAPEUTICS INC

3 patents

WAN MENG-HSUN

1 patent

WANG TZU-JUI

1 patent

WAN MENG HSUN

1 patent

CLOROX CO

1 patent

Showing the top 50 of 132 patents by PatentIndex Score.