Inventor
CHEN SZU-YING
TW132 patents
⚠️ This page may combine multiple inventors who share the name “CHEN SZU-YING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
21 patentsUS9960142B2May 1, 2018
Hybrid bonding with air-gap structure
TAIWAN SEMICONDUCTOR MFG CO LTD222 citations99
US9960129B2May 1, 2018
Hybrid bonding mechanisms for semiconductor wafers
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10388642B2Aug 20, 2019
Hybrid bonding with uniform pattern density
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10157889B2Dec 18, 2018
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9536777B2Jan 3, 2017
Interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9530811B2Dec 27, 2016
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9455158B2Sep 27, 2016
3DIC interconnect devices and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9443836B2Sep 13, 2016
Forming pixel units of image sensors through bonding two chips
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11996399B2May 28, 2024
Hybrid bonding with uniform pattern density
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11978758B2May 7, 2024
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11600653B2Mar 7, 2023
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10510912B2Dec 17, 2019
Image sensor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10475843B2Nov 12, 2019
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10304818B2May 28, 2019
Method of manufacturing semiconductor devices having conductive plugs with varying widths
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10269863B2Apr 23, 2019
Methods and apparatus for via last through-vias
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10170512B2Jan 1, 2019
Uniform-size bonding patterns
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10096645B2Oct 9, 2018
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10062721B2Aug 28, 2018
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9941249B2Apr 10, 2018
Multi-wafer stacking by Ox-Ox bonding
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9917123B2Mar 13, 2018
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9847364B2Dec 19, 2017
Image sensor devices and design and manufacturing methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
TAIWAN SEMICONDUCTOR MFG
15 patentsUS9337235B2May 10, 2016
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG227 citations99
US9312229B2Apr 12, 2016
Hybrid bonding with air-gap structure
TAIWAN SEMICONDUCTOR MFG228 citations99
US9299736B2Mar 29, 2016
Hybrid bonding with uniform pattern density
TAIWAN SEMICONDUCTOR MFG235 citations99
US9230941B2Jan 5, 2016
Bonding structure for stacked semiconductor devices
TAIWAN SEMICONDUCTOR MFG240 citations99
US9142517B2Sep 22, 2015
Hybrid bonding mechanisms for semiconductor wafers
TAIWAN SEMICONDUCTOR MFG247 citations98
US9123615B2Sep 1, 2015
Vertically integrated image sensor chips and methods for forming the same
TAIWAN SEMICONDUCTOR MFG11 citations93
US9257414B2Feb 9, 2016
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG14 citations92
US9190345B1Nov 17, 2015
Semiconductor devices and methods of manufacture thereof
TAIWAN SEMICONDUCTOR MFG24 citations92
US8878325B2Nov 4, 2014
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG12 citations92
US9293502B2Mar 22, 2016
Semiconductor switching device separated by device isolation
TAIWAN SEMICONDUCTOR MFG4 citations84
US9136302B2Sep 15, 2015
Apparatus for vertically integrated backside illuminated image sensors
TAIWAN SEMICONDUCTOR MFG11 citations84
US9123617B2Sep 1, 2015
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG4 citations84
US8946784B2Feb 3, 2015
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG8 citations84
US9287310B2Mar 15, 2016
Methods and apparatus for glass removal in CMOS image sensors
TAIWAN SEMICONDUCTOR MFG3 citations73
US8933527B2Jan 13, 2015
Elevated photodiodes with crosstalk isolation
TAIWAN SEMICONDUCTOR MFG5 citations72
CHEN SZU-YING
7 patentsUS8455971B2Jun 4, 2013
Apparatus and method for improving charge transfer in backside illuminated image sensor
CHEN SZU-YING35 citations94
US8390089B2Mar 5, 2013
Image sensor with deep trench isolation structure
CHEN SZU-YING53 citations94
US9412725B2Aug 9, 2016
Method and apparatus for image sensor packaging
CHEN SZU-YING12 citations84
US9153565B2Oct 6, 2015
Image sensors with a high fill-factor
CHEN SZU-YING14 citations84
US8883544B2Nov 11, 2014
Method of forming an image device
CHEN SZU-YING5 citations84
US8710607B2Apr 29, 2014
Method and apparatus for image sensor packaging
CHEN SZU-YING5 citations84
US9406711B2Aug 2, 2016
Apparatus and method for backside illuminated image sensors
CHEN SZU-YING5 citations73
ENCODED THERAPEUTICS INC
3 patentsWAN MENG-HSUN
1 patentWANG TZU-JUI
1 patentWAN MENG HSUN
1 patentCLOROX CO
1 patentShowing the top 50 of 132 patents by PatentIndex Score.