Inventor
WAN MENG-HSUN
TW22 patents
⚠️ This page may combine multiple inventors who share the name “WAN MENG-HSUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
12 patentsUS10157889B2Dec 18, 2018
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9530811B2Dec 27, 2016
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9443836B2Sep 13, 2016
Forming pixel units of image sensors through bonding two chips
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10475843B2Nov 12, 2019
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10062721B2Aug 28, 2018
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12068287B2Aug 20, 2024
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11587910B2Feb 21, 2023
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11037909B2Jun 15, 2021
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10930699B2Feb 23, 2021
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10510730B2Dec 17, 2019
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10510791B2Dec 17, 2019
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9716078B2Jul 25, 2017
Stacked semicondcutor structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
TAIWAN SEMICONDUCTOR MFG
7 patentsUS9337235B2May 10, 2016
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG227 citations99
US9257414B2Feb 9, 2016
Stacked semiconductor structure and method
TAIWAN SEMICONDUCTOR MFG14 citations92
US8878325B2Nov 4, 2014
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG12 citations92
US9123617B2Sep 1, 2015
Elevated photodiode with a stacked scheme
TAIWAN SEMICONDUCTOR MFG4 citations84
US8946784B2Feb 3, 2015
Method and apparatus for image sensor packaging
TAIWAN SEMICONDUCTOR MFG8 citations84
US8933527B2Jan 13, 2015
Elevated photodiodes with crosstalk isolation
TAIWAN SEMICONDUCTOR MFG5 citations72
US9368545B2Jun 14, 2016
Elevated photodiodes with crosstalk isolation
TAIWAN SEMICONDUCTOR MFG0 citations51