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Inventor
TSAI LUNG HUI
TW
2 patents
Patents
2 patents
US6561204B2
May 13, 2003
Apparatus and method for cleaning wafers with contact holes or via holes
SILICON INTEGRATED SYS CORP
0 citations
44
US6596088B2
Jul 22, 2003
Method for removing the circumferential edge of a dielectric layer
SILICON INTEGRATED SYS CORP
0 citations
42