Inventor

OKUDA YASUSHI

JP17 patents

⚠️ This page may combine multiple inventors who share the name “OKUDA YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OKUDA YASUSHI

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Semiconductor memory device having an energy gap for high speed operation

Non-volatile semiconductor memory having an array of non-volatile memory cells and method for driving the same

Nonvolatile semiconductor memory device and method for driving the same

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Semiconductor memory device and fabrication process

Method for extending electrically conductive layer into electrically insulating layer

Method for driving a non-volatile semiconductor memory

Non-volatile semiconductor memory having a ring-shaped floating gate

Method of manufacturing semiconductor device

MATSUSHITA ELECTRONICS CORP

Nonvolatile semiconductor memory device comprising a memory transistor, a select transistor, and an intermediate diffusion layer

Nonvolatile semiconductor memory device and method for driving the same

SAKURA COLOR PROD CORP

Ink composition

Fluorescent ink composition for use in marking pens

DACC DOCUMENT UPDATE

Method for fabricating semiconductor device using a CVD insulator film

MITSUBISHI HITACHI POWER SYS

Soot blower