Inventor
DEL PUERTO SANTIAGO E
US22 patents
⚠️ This page may combine multiple inventors who share the name “DEL PUERTO SANTIAGO E”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ASML HOLDING NV
14 patentsUS7025498B2Apr 11, 2006
System and method of measuring thermal expansion
ASML HOLDING NV156 citations98
US6778258B2Aug 17, 2004
Wafer handling system for use in lithography patterning
ASML HOLDING NV35 citations92
US7249925B2Jul 31, 2007
System and method for reticle protection and transport
ASML HOLDING NV14 citations90
US6991416B2Jan 31, 2006
System and method for reticle protection and transport
ASML HOLDING NV23 citations90
US10001713B2Jun 19, 2018
Lithographic apparatus and method
ASML HOLDING NV7 citations83
US7290931B2Nov 6, 2007
Vacuum pre-loaded pneumatic bearing with onboard vacuum generator
ASML HOLDING NV12 citations77
US6927842B2Aug 9, 2005
Wafer handling method for use in lithography patterning
ASML HOLDING NV5 citations74
US7009359B2Mar 7, 2006
Foam core chuck for the scanning stage of a lithography system
ASML HOLDING NV8 citations73
US7894140B2Feb 22, 2011
Compensation techniques for fluid and magnetic bearings
ASML HOLDING NV2 citations62
US7697115B2Apr 13, 2010
Resonant scanning mirror
ASML HOLDING NV5 citations62
US6947125B2Sep 20, 2005
Bearing arrangement for reaction mass in a controlled environment
ASML HOLDING NV4 citations62
US7298459B2Nov 20, 2007
Wafer handling method for use in lithography patterning
ASML HOLDING NV0 citations52
US7009685B2Mar 7, 2006
Bearing arrangement for reaction mass in a controlled environment
ASML HOLDING NV0 citations52
US9377700B2Jun 28, 2016
Determining position and curvature information directly from a surface of a patterning device
ASML HOLDING NV1 citations47
IBM
3 patentsUS5001423AMar 19, 1991
Dry interface thermal chuck temperature control system for semiconductor wafer testing
IBM210 citations93
US5186238AFeb 16, 1993
Liquid film interface cooling chuck for semiconductor wafer processing
IBM48 citations92
US5088006AFeb 11, 1992
Liquid film interface cooling system for semiconductor wafer processing
IBM32 citations92