Inventor
KU SHIH-CHANG
TW18 patents
⚠️ This page may combine multiple inventors who share the name “KU SHIH-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS11594469B2Feb 28, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations85
US10978373B2Apr 13, 2021
Semiconductor device methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10515867B2Dec 24, 2019
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11088048B2Aug 10, 2021
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12300575B2May 13, 2025
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12272616B2Apr 8, 2025
Heat-dissipating structures for semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12125824B2Oct 22, 2024
Semiconductor stack structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125812B2Oct 22, 2024
Integrated circuit packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11676943B2Jun 13, 2023
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11587845B2Feb 21, 2023
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282766B2Mar 22, 2022
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12412805B2Sep 9, 2025
Semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11996342B2May 28, 2024
Semiconductor package comprising heat dissipation plates
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
VIA TECH INC
4 patentsUS6914782B2Jul 5, 2005
Multi-opening heat-dissipation device for high-power electronic components
VIA TECH INC42 citations92
US7196904B2Mar 27, 2007
IC package with an implanted heat-dissipation fin
VIA TECH INC17 citations83
US7477515B2Jan 13, 2009
Electronic apparatus and thermal dissipating module thereof
VIA TECH INC18 citations79
US7248477B2Jul 24, 2007
Fan-shaped heat-dissipating device
VIA TECH INC3 citations61