Inventor

HUANG WEN-CHUN

TW95 patents

⚠️ This page may combine multiple inventors who share the name “HUANG WEN-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG WEN-CHUN

TAIWAN SEMICONDUCTOR MFG

Methodology of optical proximity correction optimization

Contour alignment system

Method of merging color sets of layout

Mask error enhancement factor (MEEF) aware mask rule check (MRC)

Two step molding grinding for packaging applications

Electron beam data storage system and method for high volume manufacturing

Model import for electronic design automation

Dissection splitting with optical proximity correction and mask rule check enforcement

System and method for decomposition of a single photoresist mask pattern into 3 photoresist mask patterns

Method of decomposable checking approach for mask alignment in multiple patterning

Method and apparatus for monitoring mask process impact on lithography performance

Method for metal correlated via split for double patterning

Method for integrated circuit manufacturing

Method of patterning features of a semiconductor device

Layout design for electron-beam high volume manufacturing

Method, system, and apparatus for adjusting local and global pattern density of an integrated circuit design

Target point generation for optical proximity correction

TAIWAN SEMICONDUCTOR MFG CO LTD

System and method for pattern correction in e-beam lithography

Environmental-surrounding-aware OPC

Methods for integrated circuit design and fabrication

Method and system of determining colorability of a layout

Method of post optical proximity correction (OPC) printing verification by machine learning

Methods for integrated circuit design and fabrication

Methods for generating a mandrel mask

Mandrel spacer patterning in multi-pitch integrated circuit manufacturing

Optical proximity correction methodology using pattern classification for target placement

Multiple patterning method for semiconductor devices

Method for integrated circuit manufacturing

Methodology for pattern density optimization

WANG HUNG-CHUN

Pattern correction with location effect

Methodology of optical proximity correction optimization

Geometric pattern data quality verification for maskless lithography

Striping methodology for maskless lithography

Method for high volume e-beam lithography

Providing electron beam proximity effect correction by simulating write operations of polygonal shapes

Electron beam data storage system and method for high volume manufacturing

CHENG YING-CHOU

Target-based thermal design using dummy insertion for semiconductor devices

Parameterized dummy cell insertion for process enhancement

Practical approach to layout migration

CHANG CHING-HSU

Extreme ultraviolet light (EUV) photomasks, and fabrication methods thereof

CHIANG CHIA-PING

Dissection splitting with optical proximity correction to reduce corner rounding

CHEN HUANG-YU

Method and apparatus for achieving multiple patterning technology compliant design layout

TSAI CHENG-LUNG

Pattern recognition for integrated circuit design

CHENG NIAN-FUH

Fracture aware OPC

CHEN PI-TSUNG

Decomposing integrated circuit layout

LU LEE-CHUNG

Mask-shift-aware RC extraction for double patterning design

LIU GEORGE

Intensity selective exposure photomask

HSIEH KEN-HSIEN

Double patterning methodology

LAI CHIH MING

Semiconductor interconnect structure

LIN BURN JENG

Method for metal correlated via split for double patterning