P

Inventor

WON TAE KYUNG

US50 patents
⚠️ This page may combine multiple inventors who share the name “WON TAE KYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

40 patents
US7183197B2Feb 27, 2007

Water-barrier performance of an encapsulating film

APPLIED MATERIALS INC73 citations97
US7214600B2May 8, 2007

Method to improve transmittance of an encapsulating film

APPLIED MATERIALS INC37 citations92
US7125758B2Oct 24, 2006

Controlling the properties and uniformity of a silicon nitride film by controlling the film forming precursors

APPLIED MATERIALS INC47 citations92
US10262837B2Apr 16, 2019

Plasma uniformity control by gas diffuser hole design

APPLIED MATERIALS INC5 citations84
US7884035B2Feb 8, 2011

Method of controlling film uniformity and composition of a PECVD-deposited A-SiNx : H gate dielectric film deposited over a large substrate surface

APPLIED MATERIALS INC8 citations84
US7879409B2Feb 1, 2011

Repeatability of CVD film deposition during sequential processing of substrates in a deposition chamber

APPLIED MATERIALS INC8 citations84
US7754294B2Jul 13, 2010

Method of improving the uniformity of PECVD-deposited thin films

APPLIED MATERIALS INC14 citations84
US7504332B2Mar 17, 2009

Water-barrier performance of an encapsulating film

APPLIED MATERIALS INC18 citations84
US7220687B2May 22, 2007

Method to improve water-barrier performance by changing film surface morphology

APPLIED MATERIALS INC14 citations84
US12362149B2Jul 15, 2025

Film stress control for plasma enhanced chemical vapor deposition

APPLIED MATERIALS INC1 citations74
US6858548B2Feb 22, 2005

Application of carbon doped silicon oxide film to flat panel industry

APPLIED MATERIALS INC7 citations74
US10312058B2Jun 4, 2019

Plasma uniformity control by gas diffuser hole design

APPLIED MATERIALS INC3 citations73
US6962732B2Nov 8, 2005

Process for controlling thin film uniformity and products produced thereby

APPLIED MATERIALS INC10 citations73
US11854771B2Dec 26, 2023

Film stress control for plasma enhanced chemical vapor deposition

APPLIED MATERIALS INC1 citations72
US11094508B2Aug 17, 2021

Film stress control for plasma enhanced chemical vapor deposition

APPLIED MATERIALS INC3 citations72
US10991916B2Apr 27, 2021

Thin-film encapsulation

APPLIED MATERIALS INC2 citations72
US10312475B2Jun 4, 2019

CVD thin film stress control method for display application

APPLIED MATERIALS INC3 citations72
US9634039B2Apr 25, 2017

SiON gradient concept

APPLIED MATERIALS INC3 citations72
US10134878B2Nov 20, 2018

Oxygen vacancy of IGZO passivation by fluorine treatment

APPLIED MATERIALS INC5 citations69
US9502242B2Nov 22, 2016

Indium gallium zinc oxide layers for thin film transistors

APPLIED MATERIALS INC5 citations69
US12237406B2Feb 25, 2025

Plasma treatment on metal-oxide TFT

APPLIED MATERIALS INC0 citations63
US12394595B2Aug 19, 2025

Multi-antenna unit for large area inductively coupled plasma processing apparatus

APPLIED MATERIALS INC0 citations62
US11929236B2Mar 12, 2024

Methods of tuning to improve plasma stability

APPLIED MATERIALS INC0 citations62
US11770964B2Sep 26, 2023

Thin-film encapsulation

APPLIED MATERIALS INC0 citations62
US7964430B2Jun 21, 2011

Silicon layer on a laser transparent conductive oxide layer suitable for use in solar cell applications

APPLIED MATERIALS INC2 citations62
US7833885B2Nov 16, 2010

Microcrystalline silicon thin film transistor

APPLIED MATERIALS INC2 citations62
US7955890B2Jun 7, 2011

Methods for forming an amorphous silicon film in display devices

APPLIED MATERIALS INC4 citations61
US11967516B2Apr 23, 2024

Substrate support for chucking of mask for deposition processes

APPLIED MATERIALS INC0 citations59
US10381454B2Aug 13, 2019

Interface engineering for high capacitance capacitor for liquid crystal display

APPLIED MATERIALS INC1 citations58
US12076763B2Sep 3, 2024

Selective in-situ cleaning of high-k films from processing chamber using reactive gas precursor

APPLIED MATERIALS INC0 citations52
US10854737B2Dec 1, 2020

Plasma treatment on metal-oxide TFT

APPLIED MATERIALS INC0 citations52
US10170569B2Jan 1, 2019

Thin film transistor fabrication utlizing an interface layer on a metal electrode layer

APPLIED MATERIALS INC0 citations52
US9935183B2Apr 3, 2018

Multilayer passivation or etch stop TFT

APPLIED MATERIALS INC0 citations52
US9887277B2Feb 6, 2018

Plasma treatment on metal-oxide TFT

APPLIED MATERIALS INC0 citations52
US9590113B2Mar 7, 2017

Multilayer passivation or etch stop TFT

APPLIED MATERIALS INC0 citations52
US9245809B2Jan 26, 2016

Pin hole evaluation method of dielectric films for metal oxide semiconductor TFT

APPLIED MATERIALS INC0 citations52
US6827987B2Dec 7, 2004

Method of reducing an electrostatic charge on a substrate during a PECVD process

APPLIED MATERIALS INC1 citations52
US7959987B2Jun 14, 2011

Fuel cell conditioning layer

APPLIED MATERIALS INC0 citations51
US10002711B2Jun 19, 2018

Low temperature multilayer dielectric film for passivation and capacitor

APPLIED MATERIALS INC0 citations49
US10751765B2Aug 25, 2020

Remote plasma source cleaning nozzle for cleaning a gas distribution plate

APPLIED MATERIALS INC0 citations41

CHOI SOO YOUNG

3 patents

WON TAE KYUNG

3 patents

YANG YA-TANG

2 patents

APPLIED KOMATSU TECHNOLOGY INC

1 patent

SHENG SHURAN

1 patent