Inventor
WON TAE KYUNG
US50 patents
⚠️ This page may combine multiple inventors who share the name “WON TAE KYUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
40 patentsUS7183197B2Feb 27, 2007
Water-barrier performance of an encapsulating film
APPLIED MATERIALS INC73 citations97
US7214600B2May 8, 2007
Method to improve transmittance of an encapsulating film
APPLIED MATERIALS INC37 citations92
US7125758B2Oct 24, 2006
Controlling the properties and uniformity of a silicon nitride film by controlling the film forming precursors
APPLIED MATERIALS INC47 citations92
US10262837B2Apr 16, 2019
Plasma uniformity control by gas diffuser hole design
APPLIED MATERIALS INC5 citations84
US7884035B2Feb 8, 2011
Method of controlling film uniformity and composition of a PECVD-deposited A-SiNx : H gate dielectric film deposited over a large substrate surface
APPLIED MATERIALS INC8 citations84
US7879409B2Feb 1, 2011
Repeatability of CVD film deposition during sequential processing of substrates in a deposition chamber
APPLIED MATERIALS INC8 citations84
US7754294B2Jul 13, 2010
Method of improving the uniformity of PECVD-deposited thin films
APPLIED MATERIALS INC14 citations84
US7504332B2Mar 17, 2009
Water-barrier performance of an encapsulating film
APPLIED MATERIALS INC18 citations84
US7220687B2May 22, 2007
Method to improve water-barrier performance by changing film surface morphology
APPLIED MATERIALS INC14 citations84
US12362149B2Jul 15, 2025
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC1 citations74
US6858548B2Feb 22, 2005
Application of carbon doped silicon oxide film to flat panel industry
APPLIED MATERIALS INC7 citations74
US10312058B2Jun 4, 2019
Plasma uniformity control by gas diffuser hole design
APPLIED MATERIALS INC3 citations73
US6962732B2Nov 8, 2005
Process for controlling thin film uniformity and products produced thereby
APPLIED MATERIALS INC10 citations73
US11854771B2Dec 26, 2023
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC1 citations72
US11094508B2Aug 17, 2021
Film stress control for plasma enhanced chemical vapor deposition
APPLIED MATERIALS INC3 citations72
US10991916B2Apr 27, 2021
Thin-film encapsulation
APPLIED MATERIALS INC2 citations72
US10312475B2Jun 4, 2019
CVD thin film stress control method for display application
APPLIED MATERIALS INC3 citations72
US9634039B2Apr 25, 2017
SiON gradient concept
APPLIED MATERIALS INC3 citations72
US10134878B2Nov 20, 2018
Oxygen vacancy of IGZO passivation by fluorine treatment
APPLIED MATERIALS INC5 citations69
US9502242B2Nov 22, 2016
Indium gallium zinc oxide layers for thin film transistors
APPLIED MATERIALS INC5 citations69
US12237406B2Feb 25, 2025
Plasma treatment on metal-oxide TFT
APPLIED MATERIALS INC0 citations63
US12394595B2Aug 19, 2025
Multi-antenna unit for large area inductively coupled plasma processing apparatus
APPLIED MATERIALS INC0 citations62
US11929236B2Mar 12, 2024
Methods of tuning to improve plasma stability
APPLIED MATERIALS INC0 citations62
US11770964B2Sep 26, 2023
Thin-film encapsulation
APPLIED MATERIALS INC0 citations62
US7964430B2Jun 21, 2011
Silicon layer on a laser transparent conductive oxide layer suitable for use in solar cell applications
APPLIED MATERIALS INC2 citations62
US7833885B2Nov 16, 2010
Microcrystalline silicon thin film transistor
APPLIED MATERIALS INC2 citations62
US7955890B2Jun 7, 2011
Methods for forming an amorphous silicon film in display devices
APPLIED MATERIALS INC4 citations61
US11967516B2Apr 23, 2024
Substrate support for chucking of mask for deposition processes
APPLIED MATERIALS INC0 citations59
US10381454B2Aug 13, 2019
Interface engineering for high capacitance capacitor for liquid crystal display
APPLIED MATERIALS INC1 citations58
US12076763B2Sep 3, 2024
Selective in-situ cleaning of high-k films from processing chamber using reactive gas precursor
APPLIED MATERIALS INC0 citations52
US10854737B2Dec 1, 2020
Plasma treatment on metal-oxide TFT
APPLIED MATERIALS INC0 citations52
US10170569B2Jan 1, 2019
Thin film transistor fabrication utlizing an interface layer on a metal electrode layer
APPLIED MATERIALS INC0 citations52
US9935183B2Apr 3, 2018
Multilayer passivation or etch stop TFT
APPLIED MATERIALS INC0 citations52
US9887277B2Feb 6, 2018
Plasma treatment on metal-oxide TFT
APPLIED MATERIALS INC0 citations52
US9590113B2Mar 7, 2017
Multilayer passivation or etch stop TFT
APPLIED MATERIALS INC0 citations52
US9245809B2Jan 26, 2016
Pin hole evaluation method of dielectric films for metal oxide semiconductor TFT
APPLIED MATERIALS INC0 citations52
US6827987B2Dec 7, 2004
Method of reducing an electrostatic charge on a substrate during a PECVD process
APPLIED MATERIALS INC1 citations52
US7959987B2Jun 14, 2011
Fuel cell conditioning layer
APPLIED MATERIALS INC0 citations51
US10002711B2Jun 19, 2018
Low temperature multilayer dielectric film for passivation and capacitor
APPLIED MATERIALS INC0 citations49
US10751765B2Aug 25, 2020
Remote plasma source cleaning nozzle for cleaning a gas distribution plate
APPLIED MATERIALS INC0 citations41
CHOI SOO YOUNG
3 patentsUS8083853B2Dec 27, 2011
Plasma uniformity control by gas diffuser hole design
CHOI SOO YOUNG753 citations98
US9200368B2Dec 1, 2015
Plasma uniformity control by gas diffuser hole design
CHOI SOO YOUNG6 citations84
US8142606B2Mar 27, 2012
Apparatus for depositing a uniform silicon film and methods for manufacturing the same
CHOI SOO YOUNG7 citations84