Inventor
ISAACS PHILLIP D
US17 patents
⚠️ This page may combine multiple inventors who share the name “ISAACS PHILLIP D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS6302596B1Oct 16, 2001
Small form factor optoelectronic transceivers
IBM142 citations95
US6261404B1Jul 17, 2001
Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
IBM52 citations95
US5905636AMay 18, 1999
Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
IBM72 citations95
US5745344AApr 28, 1998
Heat dissipation apparatus and method for attaching a heat dissipation apparatus to an electronic device
IBM67 citations95
US9560737B2Jan 31, 2017
Electronic package with heat transfer element(s)
IBM34 citations94
US5275330AJan 4, 1994
Solder ball connect pad-on-via assembly process
IBM231 citations94
US5651493AJul 29, 1997
Method of performing solder joint analysis of semi-conductor components
IBM22 citations92
US5446960ASep 5, 1995
Alignment apparatus and method for placing modules on a circuit board
IBM51 citations88
US11238726B2Feb 1, 2022
Control of driverless vehicles in construction zones
IBM4 citations73
US10237964B2Mar 19, 2019
Manufacturing electronic package with heat transfer element(s)
IBM4 citations73
US10956941B2Mar 23, 2021
Dynamic billboard advertisement for vehicular traffic
IBM0 citations62
US11404287B2Aug 2, 2022
Fixture facilitating heat sink fabrication
IBM0 citations61
US10978313B2Apr 13, 2021
Fixture facilitating heat sink fabrication
IBM0 citations61
US10825051B2Nov 3, 2020
Dynamic billboard advertisement for vehicular traffic
IBM0 citations52
US9839128B2Dec 5, 2017
Solder void reduction between electronic packages and printed circuit boards
IBM0 citations51
US9462703B2Oct 4, 2016
Solder void reduction between electronic packages and printed circuit boards
IBM0 citations51