Inventor
KODURI SREENIVASAN
US12 patents
⚠️ This page may combine multiple inventors who share the name “KODURI SREENIVASAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
10 patentsUS6215195B1Apr 10, 2001
Wire bonding with capillary realignment
TEXAS INSTRUMENTS INC18 citations90
US10832993B1Nov 10, 2020
Packaged multichip device with stacked die having a metal die attach
TEXAS INSTRUMENTS INC2 citations72
US6273321B1Aug 14, 2001
Wire bonding with capillary realignment
TEXAS INSTRUMENTS INC8 citations71
US5934543AAug 10, 1999
Wire bonding capillary having alignment features
TEXAS INSTRUMENTS INC12 citations71
US11908776B2Feb 20, 2024
Semiconductor device with metal die attach to substrate with multi-size cavity
TEXAS INSTRUMENTS INC0 citations62
US11282770B2Mar 22, 2022
Leadless packaged device with metal die attach
TEXAS INSTRUMENTS INC0 citations62
US10957635B2Mar 23, 2021
Multi-chip package with high thermal conductivity die attach
TEXAS INSTRUMENTS INC0 citations62
US10892209B2Jan 12, 2021
Semiconductor device with metal die attach to substrate with multi-size cavity
TEXAS INSTRUMENTS INC0 citations62
US10832991B1Nov 10, 2020
Leadless packaged device with metal die attach
TEXAS INSTRUMENTS INC1 citations62
US12040249B2Jul 16, 2024
Packages with separate communication and heat dissipation paths
TEXAS INSTRUMENTS INC0 citations60