Inventor
TOMIKAWA MASAO
JP28 patents
⚠️ This page may combine multiple inventors who share the name “TOMIKAWA MASAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TORAY INDUSTRIES
24 patentsUS6933087B2Aug 23, 2005
Precursor composition for positive photosensitive resin and display made with the same
TORAY INDUSTRIES28 citations92
US6929890B2Aug 16, 2005
Positive-type photosensitive resin composition
TORAY INDUSTRIES37 citations92
US6593043B2Jul 15, 2003
Composition of positive photosensitive resin precursor, and display device thereof
TORAY INDUSTRIES22 citations92
US6887643B2May 3, 2005
Photosensitive resin precursor composition
TORAY INDUSTRIES16 citations83
US6696112B2Feb 24, 2004
Display device having a polyimide insulating layer
TORAY INDUSTRIES14 citations83
US6524764B1Feb 25, 2003
Positive-type photosensitive polyimide precursor composition
TORAY INDUSTRIES16 citations83
US9493614B2Nov 15, 2016
Polyimide precursor, polyimide, flexible substrate prepared therewith, color filter and production method thereof, and flexible display device
TORAY INDUSTRIES7 citations81
US6723484B1Apr 20, 2004
Positive-working photosensitive resin precursor composition
TORAY INDUSTRIES7 citations72
US7455948B2Nov 25, 2008
Photosensitive resin composition
TORAY INDUSTRIES6 citations69
US11279802B2Mar 22, 2022
Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device
TORAY INDUSTRIES3 citations68
US9828469B2Nov 28, 2017
Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic EL display, and methods respectively for producing organic EL element and color filter
TORAY INDUSTRIES4 citations68
US7214455B2May 8, 2007
Photosensitive resin composition and process for producing heat-resistant resin film
TORAY INDUSTRIES3 citations62
US10941320B2Mar 9, 2021
Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion
TORAY INDUSTRIES0 citations61
US8895676B2Nov 25, 2014
Resin composition and display device using the same
TORAY INDUSTRIES2 citations60
US12534399B2Jan 27, 2026
Laminate and manufacturing method of semiconductor device
TORAY INDUSTRIES0 citations54
US9454078B2Sep 27, 2016
Positive-type photosensitive resin composition, method for producing semiconductor device including cured film using the same
TORAY INDUSTRIES1 citations51
US10177022B2Jan 8, 2019
Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
TORAY INDUSTRIES0 citations50
US7977028B2Jul 12, 2011
Photosensitive resin composition and adhesion promoter
TORAY INDUSTRIES1 citations50
US11640110B2May 2, 2023
Resin composition, method for producing heat-resistant resin film, and display device
TORAY INDUSTRIES0 citations49
US9850347B2Dec 26, 2017
Polyamic acid resin composition, polyimide film using same, and method for producing said polyimide film
TORAY INDUSTRIES0 citations48
US9822281B2Nov 21, 2017
Polyamide acid and resin composition containing same
TORAY INDUSTRIES0 citations48
US10026637B2Jul 17, 2018
Polyimide resin, resin composition using same, and laminated film
TORAY INDUSTRIES0 citations45
US10793718B2Oct 6, 2020
Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same
TORAY INDUSTRIES0 citations42
US10669377B2Jun 2, 2020
Polyimide solution, heat-resistant non-woven fabric, and method for manufacturing same
TORAY INDUSTRIES0 citations38