Inventor
SASANO TOSHIAKI
JP9 patents
Patents
9 patentsUS6467673B2Oct 22, 2002
Bonding apparatus and bonding method
SHINKAWA KK27 citations92
US6464126B2Oct 15, 2002
Bonding apparatus and bonding method
SHINKAWA KK32 citations92
US5615821AApr 1, 1997
Wire bonding method and apparatus
SHINKAWA KK26 citations91
US6762848B2Jul 13, 2004
Offset measurement method, tool position detection method and bonding apparatus
SHINKAWA KK13 citations83
US5862974AJan 26, 1999
Wire bonding method and apparatus
SHINKAWA KK12 citations72
US5579984ADec 3, 1996
Bonding coordinate teaching method and teaching means
SHINKAWA KK10 citations72
US6814121B2Nov 9, 2004
Bonding apparatus
SHINKAWA KK4 citations62
US6250534B1Jun 26, 2001
Wire bonding method
SHINKAWA KK3 citations61
US5583756ADec 10, 1996
Teaching method and teaching system for a bonding coordinate
SHINKAWA KK4 citations61