Inventor
YEH CHING-FA
TW16 patents
⚠️ This page may combine multiple inventors who share the name “YEH CHING-FA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SCIENCE COUNCIL
9 patentsUS6486057B1Nov 26, 2002
Process for preparing Cu damascene interconnection
NAT SCIENCE COUNCIL24 citations92
US5648128AJul 15, 1997
Method for enhancing the growth rate of a silicon dioxide layer grown by liquid phase deposition
NAT SCIENCE COUNCIL23 citations92
US6294832B1Sep 25, 2001
Semiconductor device having structure of copper interconnect/barrier dielectric liner/low-k dielectric trench and its fabrication method
NAT SCIENCE COUNCIL42 citations89
US5614270AMar 25, 1997
Method of improving electrical characteristics of a liquid phase deposited silicon dioxide film by plasma treatment
NAT SCIENCE COUNCIL20 citations86
US6774461B2Aug 10, 2004
Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure
NAT SCIENCE COUNCIL10 citations68
US5661051AAug 26, 1997
Method for fabricating a polysilicon transistor having a buried-gate structure
NAT SCIENCE COUNCIL12 citations66
US5776835AJul 7, 1998
Method of making a grooved gate structure of semiconductor device
NAT SCIENCE COUNCIL7 citations65
US6087276AJul 11, 2000
Method of making a TFT having an ion plated silicon dioxide capping layer
NAT SCIENCE COUNCIL6 citations60
US6903029B2Jun 7, 2005
Method of reducing thick film stress of spin-on dielectric and the resulting sandwich dielectric structure
NAT SCIENCE COUNCIL0 citations47