Inventor

AHN MOON BONG

KR2 patents

Patents

2 patents

US6653725B2Nov 25, 2003

Chip package and method of manufacturing the same

SAMSUNG ELECTRO MECH13 citations79

US6774492B2Aug 10, 2004

Chip package assembly having chip package mounted on printed circuit board

SAMSUNG ELECTRO MECH12 citations66