Inventor
HO CHOK W
US5 patents
Patents
5 patentsUS6777344B2Aug 17, 2004
Post-etch photoresist strip with O2 and NH3 for organosilicate glass low-K dielectric etch applications
LAM RES CORP25 citations91
US6620733B2Sep 16, 2003
Use of hydrocarbon addition for the elimination of micromasking during etching of organic low-k dielectrics
LAM RES CORP24 citations89
US6486070B1Nov 26, 2002
Ultra-high oxide to photoresist selective etch of high-aspect-ratio openings in a low-pressure, high-density plasma
LAM RES CORP26 citations89
US6893969B2May 17, 2005
Use of ammonia for etching organic low-k dielectrics
LAM RES CORP14 citations81
US7105454B2Sep 12, 2006
Use of ammonia for etching organic low-k dielectrics
LAM RES CORP1 citations49