Inventor · disambiguated record
Hsing-Jung Liau
Also filed as: LIAU HSING-JUNG
5 granted patents·2 pending applications·188 citations·filing 2003–2003
84Inventor score
Files withADVANCED SEMICONDUCTOR ENG6
Top patents by PatentIndex Score
7 records- 0190US6809852B2Microsystem package structureADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Oct 26, 2004·49 cites·14 claims
- 0287US6822324B2Wafer-level package with a cavity and fabricating method thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Nov 23, 2004·48 cites·26 claims
- 0385US6768207B2Multichip wafer-level package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 27, 2004·44 cites·11 claims
- 0477US6838762B2Water-level package with bump ringADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jan 4, 2005·24 cites·16 claims
- 0576US6693364B2Optical integrated circuit element package and process for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Feb 17, 2004·23 cites·14 claims
- 0636US2003193018A1Optical integrated circuit element package and method for making the sameFiled 2003·Application pending·0 cites
- 0736US2003214618A1Liquid crystal display device with bump and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
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