Inventor

CHENG LI-HUI

TW111 patents

⚠️ This page may combine multiple inventors who share the name “CHENG LI-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG LI-HUI

TAIWAN SEMICONDUCTOR MFG CO LTD

Integrated circuit package and method

Release film as isolation film in package

Integrated fan-out structure with guiding trenches in buffer layer

Adhesive and thermal interface material on a plurality of dies covered by a lid

Underfill between a first package and a second package

Semiconductor packages and forming method thereof

Adhesive and thermal interface material on a plurality of dies covered by a lid

Release film as isolation film in package

Package-on-package structure and manufacturing method thereof

Semiconductor device and method of manufactures

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

Chip package structure with adhesive layer

Multi-die structure and method of forming same

Semiconductor device and method

Integrated fan-out structure with guiding trenches in buffer layer

Semiconductor device and method of manufactures

Semiconductor device and method of manufacture

Semicondutor device and method of manufacture

Integrated fan-out structure with openings in buffer layer

Package structure and manufacturing method thereof

Method for forming package structure

Package structure and method of fabricating the same

Semiconductor devices and methods of manufacture

Manufacturing method of semiconductor package using jig

Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device

Integrated circuit packages and methods of forming same

Package structure and method of manufacturing the same

Package structure and method of fabricating the same

Semiconductor device and method of forming the same

Optical signal processing package structure

Methods of packaging semiconductor devices and packaged semiconductor devices

Package structure and method of fabricating the same

Semiconductor packages and method of manufacturing the same

Package structure and method for forming the same

Package structure having adhesive layer surrounded dam structure

Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system

Semiconductor device and method of forming the same

Semiconductor package and manufacturing method thereof

Multi-die structure and method for forming same

Package structure, integrated fan-out package and method of fabricating the same

Integrated fan-out structure with guiding trenches in buffer layer

PoP device and method of forming the same

Integrated circuit packages and methods of forming same

Semiconductor package and manufacturing method thereof

Integrated fan-out structure with guiding trenches in buffer layer

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

Integrated fan-out package structures with recesses in molding compound

TAIWAN SEMICONDUCTOR MFG

Die package with openings surrounding end-portions of through package vias (TPVs) and package on package (PoP) using the die package

Semiconductor device and manufacturing method thereof

Integrated fan-out package structures with recesses in molding compound