Inventor

CHENG WING LAU

US5 patents

⚠️ This page may combine multiple inventors who share the name “CHENG WING LAU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

2 patents

US7221553B2May 22, 2007

Substrate support having heat transfer system

APPLIED MATERIALS INC49 citations95

US7768765B2Aug 3, 2010

Substrate support having heat transfer system

APPLIED MATERIALS INC8 citations83

CHENG WING LAU

2 patents

US8146902B2Apr 3, 2012

Hybrid composite wafer carrier for wet clean equipment

CHENG WING LAU3 citations54

US8292697B2Oct 23, 2012

Method for manufacturing a hybrid composite wafer carrier for wet clean equipment

CHENG WING LAU0 citations43

NGUYEN ANDREW

1 patent

US8279577B2Oct 2, 2012

Substrate support having fluid channel

NGUYEN ANDREW8 citations82