Inventor
NAMIKI TAKAHISA
JP39 patents
⚠️ This page may combine multiple inventors who share the name “NAMIKI TAKAHISA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
34 patentsUS6013416AJan 11, 2000
Chemically amplified resist compositions and process for the formation of resist patterns
FUJITSU LTD164 citations99
US5968713AOct 19, 1999
Chemically amplified resist compositions and process for the formation of resist patterns
FUJITSU LTD165 citations99
US6329125B2Dec 11, 2001
Chemically amplified resist compositions and process for the formation of resist patterns
FUJITSU LTD154 citations98
US6200725B1Mar 13, 2001
Chemically amplified resist compositions and process for the formation of resist patterns
FUJITSU LTD105 citations97
US5633121AMay 27, 1997
Method for examining surface of copper layer in circuit board and process for producing circuit board
FUJITSU LTD28 citations93
US5482174AJan 9, 1996
Method for removing copper oxide on the surface of a copper film and a method for patterning a copper film
FUJITSU LTD30 citations93
US7338750B2Mar 4, 2008
Resist pattern thickness reducing material, resist pattern and process for forming thereof, and semiconductor device and process for manufacturing thereof
FUJITSU LTD25 citations92
US7189783B2Mar 13, 2007
Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
FUJITSU LTD13 citations92
US6506534B1Jan 14, 2003
Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
FUJITSU LTD29 citations92
US5910392AJun 8, 1999
Resist composition, a process for forming a resist pattern and a process for manufacturing a semiconductor device
FUJITSU LTD46 citations92
US5240813AAug 31, 1993
Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof
FUJITSU LTD27 citations92
US6052261AApr 18, 2000
Method for manufacturing magnetoresistance head
FUJITSU LTD23 citations91
US7585610B2Sep 8, 2009
Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same
FUJITSU LTD9 citations84
US7202289B2Apr 10, 2007
Biodegradable resin composition, filler therefor and molded article thereof
FUJITSU LTD17 citations84
US6200724B1Mar 13, 2001
Chemical amplification resist compositions and process for the formation of resist patterns
FUJITSU LTD16 citations84
US6794112B2Sep 21, 2004
Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
FUJITSU LTD4 citations74
US6773867B2Aug 10, 2004
Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
FUJITSU LTD7 citations74
US5962191AOct 5, 1999
Resist compositions for forming resist patterns
FUJITSU LTD11 citations74
US5824452AOct 20, 1998
Resist compositions and process for the formation of resist patterns
FUJITSU LTD7 citations74
US5804354ASep 8, 1998
Composition for forming conductivity imparting agent and pattern forming method
FUJITSU LTD8 citations73
US5776659AJul 7, 1998
Ionizing radiation exposure method utilizing water soluble aniline antistatic polymer layer
FUJITSU LTD13 citations73
US5484687AJan 16, 1996
Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof
FUJITSU LTD10 citations73
US8349542B2Jan 8, 2013
Manufacturing process of semiconductor device
FUJITSU LTD2 citations63
US7820367B2Oct 26, 2010
Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same
FUJITSU LTD4 citations63
US7799508B2Sep 21, 2010
Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same
FUJITSU LTD3 citations63
US7744768B2Jun 29, 2010
Resist pattern thickening material, resist pattern and forming process thereof, and semiconductor device and manufacturing process thereof
FUJITSU LTD3 citations63
US7550248B2Jun 23, 2009
Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for manufacturing the same
FUJITSU LTD4 citations63
US7361448B2Apr 22, 2008
Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the same
FUJITSU LTD3 citations63
US6794113B2Sep 21, 2004
Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
FUJITSU LTD3 citations63
US6787288B2Sep 7, 2004
Negative resist composition, method for the formation of resist patterns and process for the production of electronic devices
FUJITSU LTD2 citations63
US6582878B2Jun 24, 2003
Chemical amplification resist compositions and process for the formation of resist patterns
FUJITSU LTD3 citations63
US6465137B2Oct 15, 2002
Resist composition and pattern forming process
FUJITSU LTD5 citations62
US7452657B2Nov 18, 2008
Resist composition, method of forming resist pattern, semiconductor device and method of manufacturing thereof
FUJITSU LTD1 citations52
US7364829B2Apr 29, 2008
Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device
FUJITSU LTD0 citations52
KOZAWA MIWA
2 patentsUS8198014B2Jun 12, 2012
Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the same
KOZAWA MIWA2 citations62
US8198009B2Jun 12, 2012
Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the same
KOZAWA MIWA0 citations52