Inventor
MORIKAWA ASAO
JP19 patents
Patents
19 patentsUS5635301AJun 3, 1997
Multilayered glass substrate
NGK SPARK PLUG CO36 citations92
US4801067AJan 31, 1989
Method of connecting metal conductor to ceramic substrate
NGK SPARK PLUG CO21 citations81
US4943470AJul 24, 1990
Ceramic substrate for electrical devices
NGK SPARK PLUG CO21 citations80
US5405562AApr 11, 1995
Process of making a coated substrate having closed porosity
NGK SPARK PLUG CO5 citations74
US5261950ANov 16, 1993
Composition for metalizing ceramics
NGK SPARK PLUG CO6 citations74
US5175130ADec 29, 1992
Low-temperature baked substrate
NGK SPARK PLUG CO6 citations74
US5122930AJun 16, 1992
High heat-conductive, thick film multi-layered circuit board
NGK SPARK PLUG CO16 citations74
US5120473AJun 9, 1992
Metallizing composition for use with ceramics
NGK SPARK PLUG CO11 citations74
US4963187AOct 16, 1990
Metallizing paste for circuit board having low thermal expansion coefficient
NGK SPARK PLUG CO16 citations74
US4941582AJul 17, 1990
Hermetically sealed ceramic package
NGK SPARK PLUG CO16 citations74
US4837408AJun 6, 1989
High density multilayer wiring board and the manufacturing thereof
NGK SPARK PLUG CO18 citations74
US4871608AOct 3, 1989
High-density wiring multilayered substrate
NGK SPARK PLUG CO16 citations72
US4810528AMar 7, 1989
Process for producing multilayer circuit board
NGK SPARK PLUG CO12 citations72
US5352482AOct 4, 1994
Process for making a high heat-conductive, thick film multi-layered circuit board
NGK SPARK PLUG CO4 citations63
US5318744AJun 7, 1994
Process for producing ceramic sintered body having metallized via hole
NGK SPARK PLUG CO2 citations63
US5011530AApr 30, 1991
Metallizing composition for use with ceramics
NGK SPARK PLUG CO5 citations63
US5003131AMar 26, 1991
Connection structure between ceramic body and outer terminal
NGK SPARK PLUG CO4 citations63
US5011734AApr 30, 1991
Ceramic substrate
NGK SPARK PLUG CO1 citations52
US5006167AApr 9, 1991
Metallizing composition
NGK SPARK PLUG CO1 citations52