P

Inventor

YANG HSIU WEI

US37 patents
⚠️ This page may combine multiple inventors who share the name “YANG HSIU WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASIA VITAL COMPONENTS CO LTD

24 patents
US9700930B2Jul 11, 2017

Heat dissipation device and manufacturing method thereof

ASIA VITAL COMPONENTS CO LTD17 citations84
US10112272B2Oct 30, 2018

Manufacturing method of vapor chamber

ASIA VITAL COMPONENTS CO LTD7 citations83
US11765861B2Sep 19, 2023

Vapor chamber structure

ASIA VITAL COMPONENTS CO LTD5 citations75
US10029337B2Jul 24, 2018

Method of manufacturing heat dissipation device

ASIA VITAL COMPONENTS CO LTD2 citations73
US9772143B2Sep 26, 2017

Thermal module

ASIA VITAL COMPONENTS CO LTD5 citations73
US9549486B2Jan 17, 2017

Raised bodied vapor chamber structure

ASIA VITAL COMPONENTS CO LTD4 citations73
US9032624B2May 19, 2015

Plate-type heat pipe sealing structure and manufacturing method thereof

ASIA VITAL COMPONENTS CO LTD2 citations63
US9021698B2May 5, 2015

Flat plate heat pipe and method for manufacturing the same

ASIA VITAL COMPONENTS CO LTD3 citations63
US10785894B2Sep 22, 2020

Case heat dissipation unit of handheld electronic device

ASIA VITAL COMPONENTS CO LTD1 citations62
US10352625B2Jul 16, 2019

Thermal module

ASIA VITAL COMPONENTS CO LTD1 citations62
US7721439B2May 25, 2010

Manufacturing system for making a heat dissipating device

ASIA VITAL COMPONENTS CO LTD2 citations61
US7469740B2Dec 30, 2008

Heat dissipating device

ASIA VITAL COMPONENTS CO LTD2 citations61
US7464463B2Dec 16, 2008

Method for making a heat dissipating device

ASIA VITAL COMPONENTS CO LTD5 citations61
US7461450B2Dec 9, 2008

Method for making a heat dissipating device

ASIA VITAL COMPONENTS CO LTD4 citations61
US10107558B2Oct 23, 2018

Thermal module

ASIA VITAL COMPONENTS CO LTD0 citations52
US10101779B2Oct 16, 2018

Heat dissipation unit of handheld electronic device

ASIA VITAL COMPONENTS CO LTD1 citations52
US9903665B2Feb 27, 2018

Heat dissipation unit and thermal module thereof

ASIA VITAL COMPONENTS CO LTD0 citations52
US9453688B2Sep 27, 2016

Heat dissipation unit

ASIA VITAL COMPONENTS CO LTD1 citations52
US9879920B2Jan 30, 2018

Vapor chamber structure

ASIA VITAL COMPONENTS CO LTD0 citations51
US9421648B2Aug 23, 2016

Manufacturing method of heat pipe structure

ASIA VITAL COMPONENTS CO LTD1 citations51
US10788869B2Sep 29, 2020

Heat-conducting case unit for handheld electronic device

ASIA VITAL COMPONENTS CO LTD0 citations42
US10602642B2Mar 24, 2020

Back cover unit applied to portable device and having heat conduction function

ASIA VITAL COMPONENTS CO LTD0 citations42
US10307874B2Jun 4, 2019

Method for sealing a heat transfer unit

ASIA VITAL COMPONENTS CO LTD0 citations42
US9802240B2Oct 31, 2017

Thin heat pipe structure and manufacturing method thereof

ASIA VITAL COMPONENTS CO LTD0 citations42

YANG HSIU-WEI

9 patents

INTERCONTINENTAL GREAT BRANDS LLC

3 patents

YANG HSIU WEI

1 patent