Inventor

CHEN YU-FENG

TW107 patents

⚠️ This page may combine multiple inventors who share the name “CHEN YU-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN YU-FENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Package structures and method of forming the same

Semiconductor package and manufacturing method thereof

Multi-die package with bridge layer and method for making the same

Semiconductor package and manufacturing process thereof

Semiconductor package and manufacturing process thereof

Fingerprint sensor device and method

Contact area design for solder bonding

Hybrid interconnect for chip stacking

Fingerprint sensor device and method

Contact area design for solder bonding

Chip packages and methods of manufacture thereof

Multi-chip package system and methods of forming the same

Bumps for chip scale packaging including under bump metal structures with different diameters

Package structures and method of forming the same

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor device and method

Scheme for connector site spacing and resulting structures

Fingerprint sensor in InFO structure and formation method

Fingerprint sensor device and method

Fingerprint sensor pixel array and methods of forming same

Protrusion bump pads for bond-on-trace processing

Fingerprint sensor pixel array and methods of forming same

Fingerprint sensor device and method

Integrated circuit package and method of forming same

Packaging device having plural microstructures disposed proximate to die mounting region

Semiconductor device

Packaging device having plural microstructures disposed proximate to die mounting region

Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof

Protrusion bump pads for bond-on-trace processing

Copper-containing layer on under-bump metallization layer

Semiconductor device and method of forming same

Fingerprint sensor device and method

Fingerprint sensor in InFO structure and formation method

Package structure and method of forming the same

Package structures and method of forming the same

MICRON TECHNOLOGY INC

Systems and methods for improving fuse systems in memory devices

Electronic device with a fuse array mechanism

Systems and methods for plate voltage regulation during memory array access

Electronic device with a fuse array mechanism

TAIWAN SEMICONDUCTOR MFG

Scheme for connector site spacing and resulting structures

Methods and apparatus for package with interposers

Package on package devices and methods of packaging semiconductor dies

Semiconductor devices and methods of manufacture thereof

CHEN YU-FENG

Crack stopper on under-bump metallization layer

Extending metal traces in bump-on-trace structures

HSU CHUN-LEI

Package on package devices and methods of packaging semiconductor dies

SHIEH YUH CHERN

Reduced-stress bump-on-trace (BOT) structures

LIN CHUN-HUNG

Stress compensation layer for 3D packaging

PAMELAN COMPANY LTD

Ink-jet head with bubble-driven flexible membrane

AUDIOWISE TECH INC

Bluetooth communication system, electronic device and Bluetooth chip having low power consumption