Inventor
SON IL-SEOK
US11 patents
Patents
11 patentsUS10797139B2Oct 6, 2020
Methods of forming backside self-aligned vias and structures formed thereby
INTEL CORP22 citations94
US11264493B2Mar 1, 2022
Wrap-around source/drain method of making contacts for backside metals
INTEL CORP9 citations85
US10367070B2Jul 30, 2019
Methods of forming backside self-aligned vias and structures formed thereby
INTEL CORP8 citations84
US10490449B2Nov 26, 2019
Techniques for revealing a backside of an integrated circuit device, and associated configurations
INTEL CORP1 citations72
US12100762B2Sep 24, 2024
Wrap-around source/drain method of making contacts for backside metals
INTEL CORP0 citations62
US12100761B2Sep 24, 2024
Wrap-around source/drain method of making contacts for backside metals
INTEL CORP0 citations62
US11594452B2Feb 28, 2023
Techniques for revealing a backside of an integrated circuit device, and associated configurations
INTEL CORP0 citations62
US10896847B2Jan 19, 2021
Techniques for revealing a backside of an integrated circuit device, and associated configurations
INTEL CORP0 citations62
US10236282B2Mar 19, 2019
Partial layer transfer system and method
INTEL CORP0 citations52
US9721898B2Aug 1, 2017
Methods of forming under device interconnect structures
INTEL CORP0 citations48
US9490201B2Nov 8, 2016
Methods of forming under device interconnect structures
INTEL CORP0 citations48