Inventor
CHI YUAN-HSIN
TW16 patents
Patents
16 patentsUS11851325B2Dec 26, 2023
Methods for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12562347B2Feb 24, 2026
Connect structure for semiconductor processing equipment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12518980B2Jan 6, 2026
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12040163B2Jul 16, 2024
Connect structure for semiconductor processing equipment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11862482B2Jan 2, 2024
Semiconductor substrate bonding tool and methods of operation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12234145B2Feb 25, 2025
Methods for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12142514B2Nov 12, 2024
Clamp ring and method of using clamp ring
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12020994B2Jun 25, 2024
Power alarm and fire loading risk reduction for a deposition tool
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12002699B2Jun 4, 2024
Wafer pod transfer assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11600506B2Mar 7, 2023
Wafer pod transfer assembly
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11955317B2Apr 9, 2024
Radio frequency match strap assembly
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12466727B2Nov 11, 2025
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11655146B2May 23, 2023
Extended acid etch for oxide removal
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12243848B2Mar 4, 2025
Methods and systems for improving fusion bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations55
US12394647B2Aug 19, 2025
Wafer shift detection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12286706B2Apr 29, 2025
Structures and methods for processing a semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46