Inventor
HAIDER AFREEN
IN5 patents
Patents
5 patentsUS12314204B2May 27, 2025
Single clock lane operation for a main band of a die-to-die connection
QUALCOMM INC0 citations56
US12430280B2Sep 30, 2025
Mechanism to improve the reliability of sideband in chiplets
QUALCOMM INC0 citations48
US12499077B2Dec 16, 2025
Variable link width in two directions for main band chip module connection
QUALCOMM INC0 citations46
US12386382B2Aug 12, 2025
Reduced training for main band chip module interconnection clock lines
QUALCOMM INC0 citations46
US12380047B2Aug 5, 2025
Expanded data link width for main band chip module connection in alternate modes
QUALCOMM INC0 citations46