Inventor
AKIYAMA SHINICHI
45 patents
⚠️ This page may combine multiple inventors who share the name “AKIYAMA SHINICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NIPPON ZEON CO
10 patentsUS4272637AJun 9, 1981
Catalyst for oxidation of isobutylene
NIPPON ZEON CO30 citations91
US4155938AMay 22, 1979
Oxidation of olefins
NIPPON ZEON CO41 citations89
US4186152AJan 29, 1980
Oxidation of olefins
NIPPON ZEON CO29 citations82
US4075244AFeb 21, 1978
Process for preparing methacrylic acid
NIPPON ZEON CO22 citations82
US3976688AAug 24, 1976
Process for preparing unsaturated carboxylic acids
NIPPON ZEON CO23 citations82
US4245118AJan 13, 1981
Oxidation of unsaturated aldehydes
NIPPON ZEON CO19 citations80
US4238359ADec 9, 1980
Process for preparing spherical shaped pelletized oxide catalysts comprising molybdenum and phosphorus
NIPPON ZEON CO9 citations73
US4564703AJan 14, 1986
Process for preparing methacrylic acid
NIPPON ZEON CO4 citations63
US4220802ASep 2, 1980
Process for the preparation of acrylic acid
NIPPON ZEON CO6 citations63
US4113770ASep 12, 1978
Process for preparing unsaturated carboxylic acids
NIPPON ZEON CO3 citations63
AKIYAMA SHINICHI
8 patentsUS8569124B2Oct 29, 2013
Method of manufacturing compound semiconductor device with gate electrode forming before source electrode and drain electrode
AKIYAMA SHINICHI20 citations90
US8551832B2Oct 8, 2013
Method for manufacturing semiconductor device
AKIYAMA SHINICHI3 citations62
US8338953B2Dec 25, 2012
Method of manufacturing a semiconductor device and semiconductor device
AKIYAMA SHINICHI2 citations62
US8196803B2Jun 12, 2012
Method of manufacturing semiconductor device and wire bonding apparatus
AKIYAMA SHINICHI3 citations62
US8123108B2Feb 28, 2012
Method of manufacturing semiconductor device and wire bonding apparatus
AKIYAMA SHINICHI5 citations62
US8679973B2Mar 25, 2014
Method of manufacturing semiconductor device
AKIYAMA SHINICHI2 citations61
US8148262B2Apr 3, 2012
Method for manufacturing semiconductor device
AKIYAMA SHINICHI3 citations60
US8536708B2Sep 17, 2013
Method of manufacturing a semiconductor device and semiconductor device
AKIYAMA SHINICHI0 citations51
FUJITSU SEMICONDUCTOR LTD
5 patentsUS7829461B2Nov 9, 2010
Method for fabricating semiconductor device
FUJITSU SEMICONDUCTOR LTD4 citations63
US8030207B2Oct 4, 2011
Method of manufacturing a semiconductor device and semiconductor device
FUJITSU SEMICONDUCTOR LTD1 citations62
US8026164B2Sep 27, 2011
Semiconductor device and method of manufacturing the same
FUJITSU SEMICONDUCTOR LTD5 citations61
US8889505B2Nov 18, 2014
Method for manufacturing semiconductor device
FUJITSU SEMICONDUCTOR LTD0 citations52
US9123728B2Sep 1, 2015
Semiconductor device and method for manufacturing semiconductor device
FUJITSU SEMICONDUCTOR LTD0 citations51
SHINKAWA KK
4 patentsUS9368471B2Jun 14, 2016
Wire-bonding apparatus and method of manufacturing semiconductor device
SHINKAWA KK3 citations71
US7661576B2Feb 16, 2010
Wire bonding method
SHINKAWA KK0 citations52
US7617966B2Nov 17, 2009
Semiconductor device
SHINKAWA KK0 citations52
US7458498B2Dec 2, 2008
Semiconductor device and a wire bonding method
SHINKAWA KK0 citations52
YAZAKI CORP
3 patentsSANYO ELECTRIC CO
3 patentsTRANSPHORM JAPAN INC
2 patentsKONICA MINOLTA INC
2 patentsUS10997723B2May 4, 2021
Image forming system, image forming apparatus, and program
KONICA MINOLTA INC0 citations52
US10162586B2Dec 25, 2018
Roll printing device, non-transitory recording medium storing program for controlling printing on roll of print media, and method for the same
KONICA MINOLTA INC0 citations42