Inventor
JOHNSON ERIC ARTHUR
US27 patents
⚠️ This page may combine multiple inventors who share the name “JOHNSON ERIC ARTHUR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
18 patentsUS6490161B1Dec 3, 2002
Peripheral land grid array package with improved thermal performance
IBM216 citations99
US5883430AMar 16, 1999
Thermally enhanced flip chip package
IBM149 citations99
US5726079AMar 10, 1998
Thermally enhanced flip chip package and method of forming
IBM139 citations99
US5877043AMar 2, 1999
Electronic package with strain relief means and method of making
IBM243 citations97
US6486554B2Nov 26, 2002
Molded body for PBGA and chip-scale packages
IBM60 citations96
US5760465AJun 2, 1998
Electronic package with strain relief means
IBM97 citations96
US5969947AOct 19, 1999
Integral design features for heatsink attach for electronic packages
IBM48 citations94
US6528892B2Mar 4, 2003
Land grid array stiffener use with flexible chip carriers
IBM108 citations92
US5888849AMar 30, 1999
Method for fabricating an electronic package
IBM24 citations92
US6883593B2Apr 26, 2005
Heat sink for convection cooling in horizontal applications
IBM18 citations91
US6691769B2Feb 17, 2004
Heat sink for convection cooling in horizontal applications
IBM20 citations91
US6403882B1Jun 11, 2002
Protective cover plate for flip chip assembly backside
IBM34 citations91
US6373703B2Apr 16, 2002
Integral design features for heatsink attach for electronic packages
IBM38 citations90
US6512295B2Jan 28, 2003
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
IBM15 citations84
US6670223B2Dec 30, 2003
Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses
IBM10 citations74
US6495771B2Dec 17, 2002
Compliant multi-layered circuit board for PBGA applications
IBM9 citations74
USRE39426EDec 12, 2006
Thermally enhanced flip chip package and method of forming
IBM2 citations63
US6905961B2Jun 14, 2005
Land grid array stiffener for use with flexible chip carriers
IBM2 citations62
ADVANCED DESIGN CONSULTING USA
7 patentsUS7038470B1May 2, 2006
Parallel-plate capacitive element for monitoring environmental parameters in concrete
ADVANCED DESIGN CONSULTING USA187 citations99
US7551058B1Jun 23, 2009
Sensor for monitoring environmental parameters in concrete
ADVANCED DESIGN CONSULTING USA97 citations97
US7264649B1Sep 4, 2007
System for allergen reduction through indoor humidity control
ADVANCED DESIGN CONSULTING USA54 citations95
US7100437B2Sep 5, 2006
Device for collecting statistical data for maintenance of small-arms
ADVANCED DESIGN CONSULTING USA53 citations95
US7143644B2Dec 5, 2006
Device for collecting statistical data for maintenance of small-arms
ADVANCED DESIGN CONSULTING USA101 citations94
US7134645B1Nov 14, 2006
Winch assembly for use with synthetic ropes
ADVANCED DESIGN CONSULTING USA55 citations91
US7019522B1Mar 28, 2006
Apparatus for measuring the magnetic field produced by an insertion device
ADVANCED DESIGN CONSULTING USA5 citations62