Inventor
YODO YOSHIAKI
JP49 patents
Patents
49 patentsUS9093519B2Jul 28, 2015
Wafer processing method
DISCO CORP7 citations84
US11289379B2Mar 29, 2022
Wafer processing method
DISCO CORP2 citations73
US11222807B2Jan 11, 2022
Processing method and thermocompression bonding method for workpiece
DISCO CORP2 citations73
US10847420B2Nov 24, 2020
Wafer processing method
DISCO CORP2 citations73
US11348797B2May 31, 2022
Stacked wafer processing method
DISCO CORP2 citations72
US10515840B2Dec 24, 2019
Expanding method and expanding apparatus
DISCO CORP3 citations72
US11823942B2Nov 21, 2023
Thermocompression bonding method for workpiece
DISCO CORP0 citations62
US11062948B2Jul 13, 2021
Wafer processing method
DISCO CORP1 citations62
US11037814B2Jun 15, 2021
Wafer processing method using a ring frame with a polyester sheet with no adhesive layer
DISCO CORP1 citations62
US11024543B2Jun 1, 2021
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP1 citations62
US10991624B2Apr 27, 2021
Wafer processing method including applying a polyolefin sheet to a wafer
DISCO CORP1 citations62
US11610815B2Mar 21, 2023
Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer
DISCO CORP0 citations52
US11594454B2Feb 28, 2023
Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer
DISCO CORP0 citations52
US11587833B2Feb 21, 2023
Wafer processing method including uniting wafer, ring frame, and polyolefin sheet without using an adhesive layer
DISCO CORP0 citations52
US11587832B2Feb 21, 2023
Wafer processing method including uniting wafer, ring frame and polyolefin sheet without using an adhesive layer
DISCO CORP0 citations52
US11545393B2Jan 3, 2023
Wafer processing method including uniting wafer, ring frame and polyester sheet without using an adhesive layer
DISCO CORP0 citations52
US11476161B2Oct 18, 2022
Wafer processing method including applying a polyolefin sheet to a wafer
DISCO CORP0 citations52
US11393721B2Jul 19, 2022
Wafer processing method
DISCO CORP0 citations52
US11380587B2Jul 5, 2022
Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer
DISCO CORP0 citations52
US11380588B2Jul 5, 2022
Wafer processing method including uniting a wafer, a ring frame and a polyester sheet without using an adhesive layer
DISCO CORP0 citations52
US11361997B2Jun 14, 2022
Wafer processing method including uniting a wafer, ring frame and a polyolefin sheet without using an adhesive layer
DISCO CORP0 citations52
US11322407B2May 3, 2022
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP0 citations52
US11322406B2May 3, 2022
Wafer processing method
DISCO CORP0 citations52
US11302578B2Apr 12, 2022
Wafer processing method
DISCO CORP0 citations52
US11270916B2Mar 8, 2022
Wafer processing method
DISCO CORP0 citations52
US11251082B2Feb 15, 2022
Wafer processing method
DISCO CORP0 citations52
US11127633B2Sep 21, 2021
Wafer processing method including a thermocompression bonding step of bonding a wafer to a ring frame via a polyolefin sheet
DISCO CORP0 citations52
US11069574B2Jul 20, 2021
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP0 citations52
US11056334B2Jul 6, 2021
Wafer processing method using a ring frame and a polyester sheet
DISCO CORP0 citations52
US11049772B2Jun 29, 2021
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP0 citations52
US11049757B2Jun 29, 2021
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP0 citations52
US11043421B2Jun 22, 2021
Wafer processing method
DISCO CORP0 citations52
US11037813B2Jun 15, 2021
Wafer processing method
DISCO CORP0 citations52
US11031234B2Jun 8, 2021
Wafer processing method including applying a polyolefin sheet to a wafer
DISCO CORP0 citations52
US11018058B2May 25, 2021
Wafer processing method for dividing a wafer along predefined division lines using polyester sheet
DISCO CORP0 citations52
US11018043B2May 25, 2021
Wafer processing method using a ring frame and a polyester sheet
DISCO CORP0 citations52
US11011407B2May 18, 2021
Wafer processing method using a ring frame and a polyolefin sheet
DISCO CORP0 citations52
US11004744B2May 11, 2021
Wafer processing method for dividing a wafer along predefined division lines
DISCO CORP0 citations52
US10998232B2May 4, 2021
Wafer processing method of uniting a wafer and a ring frame using a polyolefin sheet
DISCO CORP0 citations52
US10991587B2Apr 27, 2021
Wafer processing method including applying a polyester sheet to a wafer
DISCO CORP0 citations52
US10985066B2Apr 20, 2021
Wafer processing method for dividing a wafer along division lines
DISCO CORP0 citations52
US10985067B2Apr 20, 2021
Wafer processing method using a laser beam dividing step
DISCO CORP0 citations52
US10910269B2Feb 2, 2021
Wafer processing method
DISCO CORP0 citations52
US10896850B2Jan 19, 2021
Wafer processing method
DISCO CORP0 citations52
US11569129B2Jan 31, 2023
Workpiece processing method
DISCO CORP0 citations51
US9054179B2Jun 9, 2015
Wafer processing method
DISCO CORP1 citations49
US10720355B2Jul 21, 2020
Wafer processing method
DISCO CORP0 citations41
US10265805B2Apr 23, 2019
Method of processing workpiece
DISCO CORP0 citations41
US9449878B2Sep 20, 2016
Wafer processing method
DISCO CORP0 citations41