Inventor
KWON HYEOG CHAN
KR20 patents
⚠️ This page may combine multiple inventors who share the name “KWON HYEOG CHAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
13 patentsUS7288835B2Oct 30, 2007
Integrated circuit package-in-package system
STATS CHIPPAC LTD135 citations98
US7501697B2Mar 10, 2009
Integrated circuit package system
STATS CHIPPAC LTD16 citations92
US7737539B2Jun 15, 2010
Integrated circuit package system including honeycomb molding
STATS CHIPPAC LTD30 citations91
US7652376B2Jan 26, 2010
Integrated circuit package system including stacked die
STATS CHIPPAC LTD11 citations84
US7456088B2Nov 25, 2008
Integrated circuit package system including stacked die
STATS CHIPPAC LTD13 citations84
US8375576B2Feb 19, 2013
Method for manufacturing wafer scale heat slug system
STATS CHIPPAC LTD12 citations83
US7975377B2Jul 12, 2011
Wafer scale heat slug system
STATS CHIPPAC LTD9 citations83
US7884460B2Feb 8, 2011
Integrated circuit packaging system with carrier and method of manufacture thereof
STATS CHIPPAC LTD5 citations73
US7755180B2Jul 13, 2010
Integrated circuit package-in-package system
STATS CHIPPAC LTD5 citations73
US7545031B2Jun 9, 2009
Multipackage module having stacked packages with asymmetrically arranged die and molding
STATS CHIPPAC LTD7 citations73
US7875966B2Jan 25, 2011
Stacked integrated circuit and package system
STATS CHIPPAC LTD3 citations62
US8049322B2Nov 1, 2011
Integrated circuit package-in-package system and method for making thereof
STATS CHIPPAC LTD0 citations52
US7932593B2Apr 26, 2011
Multipackage module having stacked packages with asymmetrically arranged die and molding
STATS CHIPPAC LTD0 citations51