Inventor

LEUNG PAK

US7 patents

⚠️ This page may combine multiple inventors who share the name “LEUNG PAK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

2 patents

US7875544B2Jan 25, 2011

Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation

INFINEON TECHNOLOGIES AG2 citations58

US8378493B2Feb 19, 2013

Generation of metal holes by via mutation

INFINEON TECHNOLOGIES AG0 citations47

IBM

1 patent

US7790601B1Sep 7, 2010

Forming interconnects with air gaps

IBM26 citations91

ROGEL ESTRELLA

1 patent

US9921203B2Mar 20, 2018

Method for predicting sediment content of a hydroprocessed hydrocarbon product

ROGEL ESTRELLA6 citations70

LINIGER ERIC G

1 patent

US9018089B2Apr 28, 2015

Multiple step anneal method and semiconductor formed by multiple step anneal

LINIGER ERIC G6 citations67

UNITED MICROELECTRONICS CO

1 patent

US6960835B2Nov 1, 2005

Stress-relief layer for semiconductor applications

UNITED MICROELECTRONICS CO4 citations59

UNITED MICROELECTRONICS CORP

1 patent

US7188321B2Mar 6, 2007

Generation of metal holes by via mutation

UNITED MICROELECTRONICS CORP4 citations58